Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly - part I: Creep constitutive relation and fatigue model

被引：3
|
作者：
Xunqing S. [1 ]
Zhiping W. [2 ]
Pang J.H.L. [2 ]
Xueren Z. [1 ]
Jingxu N. [1 ]
机构：
[1] Dept. of Power Eng., Beijing Univ. of Aeronautics and Astronautics
[2] School of Mech. and Prod. Eng., Nanyang Technological Univ., Singapore 639798, Nanyang Avenue
来源：
Acta Mechanica Sinica/Lixue Xuebao | 2002年 / 18卷 / 03期
基金：
中国国家自然科学基金;
关键词：
Constitutive relation; Creep-fatigue interaction; Dislocation controlled creep flow; Life prediction model; Solder joint reliability;
D O I：
10.1007/BF02487955
中图分类号：
学科分类号：
摘要：
A new unified creep constitutive relation and a modified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn-Pb solders. It is found that the relation successfully elucidates the creep mechanism related to current constitutive relation. The model can be used to describe the temperature and frequency dependent low cycle fatigue behavior of the solder. The relation and the model were further employed in part II to develop the numerical simulation approach for the long-term reliability assessment of the plastic ball grid array (BGA) assembly.
引用
收藏
页码：274 / 287
页数：13
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