Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints

被引：0
|
作者：
Zhong, W.H. [1 ]
Chan, Y.C. [1 ]
Alam, M.O. [1 ]
Wu, B.Y. [1 ]
Guan, J.F. [2 ]
机构：
[1] Department of Electronic Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon, Hong Kong, Hong Kong
[2] Department of Mineral Processing, Wuhan University of Science Technology, Wuhan, China
来源：
Journal of Alloys and Compounds | 2006年 / 414卷 / 1-2期
关键词：
Soldered joints;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Journal article (JA)
引用
收藏
页码：123 / 130
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