Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly - part I: Creep constitutive relation and fatigue model

被引：3

作者：

Xunqing S. ^{[1
]}

Zhiping W. ^{[2
]}

Pang J.H.L. ^{[2
]}

Xueren Z. ^{[1
]}

Jingxu N. ^{[1
]}

机构：

[1] Dept. of Power Eng., Beijing Univ. of Aeronautics and Astronautics

[2] School of Mech. and Prod. Eng., Nanyang Technological Univ., Singapore 639798, Nanyang Avenue

来源：

Acta Mechanica Sinica/Lixue Xuebao | 2002年 / 18卷 / 03期

基金：

中国国家自然科学基金;

关键词：

Constitutive relation; Creep-fatigue interaction; Dislocation controlled creep flow; Life prediction model; Solder joint reliability;

D O I：

10.1007/BF02487955

中图分类号：

学科分类号：

摘要：

A new unified creep constitutive relation and a modified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn-Pb solders. It is found that the relation successfully elucidates the creep mechanism related to current constitutive relation. The model can be used to describe the temperature and frequency dependent low cycle fatigue behavior of the solder. The relation and the model were further employed in part II to develop the numerical simulation approach for the long-term reliability assessment of the plastic ball grid array (BGA) assembly.

引用

页码：274 / 287

页数：13

共 24 条

[21] Reliability model for bridging failure of Pb-free ball grid array solder joints under compressive load
Chiu, Tz-Cheng
Lin, Jyun-Ji
Yang, Hung-Chun
Gupta, Vikas
[J]. MICROELECTRONICS RELIABILITY, 2010, 50 (12) : 2037 - 2050
[22] Reliability assessment of PBGA solder joints using the new creep constitutive relationship and modified energy-based life prediction model
Shi, XQ
Yang, QJ
Wang, ZP
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[J]. PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, : 398 - 405
[23] Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration
Lee, Jisup
Jeong, Hyunsik
Jang, Gunhee
[J]. MATERIALS, 2024, 17 (03)
[24] An analytical elasto-creep model of solder joints in leadless chip resistors: Part 2 - Applications in fatigue reliability predictions for SnPb and lead-free solders
Ghorbani, Hamid R.
Spelt, Jan K.
[J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (04): : 695 - 704

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