Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly - Part I: Creep constitutive relation and fatigue model

被引：0

作者：

Shi, XQ ^{[1
]}

Wang, ZP

Pang, JHL

Zhang, XR

Nie, JX

机构：

[1] Beijing Univ Aeronaut & Astronaut, Dept Power Engn, Beijing 100083, Peoples R China

[2] Nanyang Technol Univ, Sch Mech & Prod Engn, Singapore 639798, Singapore

来源：

ACTA MECHANICA SINICA | 2002年 / 18卷 / 03期

关键词：

dislocation controlled creep flow; creep-fatigue interaction; constitutive relation; life prediction model; solder joint reliability;

D O I：

暂无

中图分类号：

TH [机械、仪表工业];

学科分类号：

0802 ;

摘要：

In this study, a new unified creep constitutive relation and a modified energy-based fatigue model have been established respectively to describe the creep flow and predict the fatigue life of Sn-Pb solders. It is found that the relation successfully elucidates the creep mechanism related to current constitutive relations. The model can be used to describe the temperature and frequency dependent low cycle fatigue behavior of the solder. The relation and the model are further employed in part II to develop the numerical simulation approach for the long-term reliability assessment of the plastic ball grid array (BGA) assembly.

引用

页码：274 / 287

页数：14

共 24 条

[1] Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly - part I: Creep constitutive relation and fatigue model
Xunqing S.
Zhiping W.
Pang J.H.L.
Xueren Z.
Jingxu N.
[J]. Acta Mechanica Sinica/Lixue Xuebao, 2002, 18 (03): : 274 - 287
[2] QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY (BGA) ASSEMBLY——PART Ⅰ: CREEP CONSTITUTIVE RELATION AND FATIGUE MODEL
史训清
王志平
John HL Pang
张学仁
聂景旭
[J]. Acta Mechanica Sinica, 2002, 18 (03) : 274 - 287
[3] QUICK ASSESSMENT METHODOLOGY FOR RELIABILITY OF SOLDER JOINTS IN BALL GRID ARRAY(BGA)ASSEMBLY——PART Ⅱ:RELIABILITY EXPERIMENT AND NUMERICAL SIMULATION
史训清
John HL Pang
杨前进
王志平
聂景旭
[J]. Acta Mechanica Sinica, 2002, (04) : 356 - 367
[4] Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly - Part II: Reliability experiment and numerical simulation
Shi, XQ
Pang, JHL
Yang, QJ
Wang, ZP
Nie, JX
[J]. ACTA MECHANICA SINICA, 2002, 18 (04) : 356 - 367
[5] Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly—Part II: Reliability experiment and numerical simulation
Shi Xunqing
John HL Pang
Yang Qianjin
Wang Zhiping
Nie Jingxu
[J]. Acta Mechanica Sinica, 2002, 18 (4) : 356 - 367
[6] Quick assessment methodology for reliability of solder joints in ball grid array (BGA) assembly-part II: Reliability experiment and numerical simulation
Shi, Xunqing
Pang, John H.L.
Yang, Qianjin
Wang, Zhiping
Nie, Jingxu
[J]. Acta Mechanica Sinica/Lixue Xuebao, 2002, 18 (04): : 356 - 367
[7] Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints
Zhong, W.H.
Chan, Y.C.
Alam, M.O.
Wu, B.Y.
Guan, J.F.
[J]. Journal of Alloys and Compounds, 2006, 414 (1-2): : 123 - 130
[8] Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints
Zhong, WH
Chan, YC
Alam, MO
Wu, BY
Guan, JF
[J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 414 (1-2) : 123 - 130
[9] A reliability evaluation of lead-free ball grid array (BGA) solder joints through mechanical fatigue testing
Ryan, C
Punch, J
Rodgers, B
[J]. THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2005, : 436 - 440
[10] Thermal fatigue life of ball grid array (BGA) solder joints made from different alloy compositions
Depiver, Joshua A.
Mallik, Sabuj
Amalu, Emeka H.
[J]. ENGINEERING FAILURE ANALYSIS, 2021, 125

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