Wafer-scale transfer of tungsten disulfide

被引:0
|
作者
Katharina Zeissler
机构
[1] Nature Electronics,
来源
Nature Electronics | 2022年 / 5卷
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:410 / 410
相关论文
共 50 条
  • [41] Top-Down Integration of Molybdenum Disulfide Transistors with Wafer-Scale Uniformity and Layer Controllability
    Shi, Mao-Lin
    Chen, Lin
    Zhang, Tian-Bao
    Xu, Jing
    Zhu, Hao
    Sun, Qing-Qing
    Zhang, David Wei
    SMALL, 2017, 13 (35)
  • [42] Wafer-scale transferable molybdenum disulfide thin-film catalysts for photoelectrochemical hydrogen production
    Kwon, Ki Chang
    Choi, Seokhoon
    Hong, Kootak
    Moon, Cheon Woo
    Shim, Young-Seok
    Kim, Do Hong
    Kim, Taemin
    Sohn, Woonbae
    Jeon, Jong-Myeong
    Lee, Chul-Ho
    Nam, Ki Tae
    Han, Seungwu
    Kim, Soo Young
    Jang, Ho Won
    ENERGY & ENVIRONMENTAL SCIENCE, 2016, 9 (07) : 2240 - 2248
  • [43] Hypercube design on wafer-scale integration
    Ito, Hideo
    Suzuki, Nobuyuki
    Systems and Computers in Japan, 1991, 22 (04) : 29 - 40
  • [44] Wafer-Scale Graphene Integrated Circuit
    Lin, Yu-Ming
    Valdes-Garcia, Alberto
    Han, Shu-Jen
    Farmer, Damon B.
    Meric, Inanc
    Sun, Yanning
    Wu, Yanqing
    Dimitrakopoulos, Christos
    Grill, Alfred
    Avouris, Phaedon
    Jenkins, Keith A.
    SCIENCE, 2011, 332 (6035) : 1294 - 1297
  • [45] SOFTWARE IS THE KEY TO WAFER-SCALE RAM
    HERRIOT, J
    HIGH PERFORMANCE SYSTEMS-THE MAGAZINE FOR TECHNOLOGY CHAMPIONS, 1990, 11 (01): : 36 - 37
  • [46] WAFER-SCALE INTEGRATION OF SYSTOLIC ARRAYS
    LEIGHTON, T
    LEISERSON, CE
    IEEE TRANSACTIONS ON COMPUTERS, 1985, 34 (05) : 448 - 461
  • [47] Heterogeneous wafer-scale circuit architectures
    Katehi, Linda
    Chappell, William
    Mohammadi, Saeed
    Margomenos, Alexandros
    Steer, Michael
    IEEE MICROWAVE MAGAZINE, 2007, 8 (01) : 52 - 69
  • [48] Wafer-scale integration peters out
    不详
    EDN, 2006, 51 (13) : 86 - 86
  • [49] THE ELSA WAFER-SCALE INTEGRATION PROJECT
    IVEY, P
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1993, 16 (07): : 626 - 636
  • [50] THE LATEST WAFER-SCALE DESIGN IS A HYBRID
    LYMAN, J
    ELECTRONICS-US, 1986, 59 (11): : 28 - 28