Multichip thinning technology with temporary bonding for multichip-to-wafer 3D integration

被引：0
|
作者：
Lee, Sungho [1 ]
Liang, Rui [2 ]
Miwa, Yuki [3 ]
Kino, Hisashi [4 ]
Fukushima, Takafumi [1 ]
Tanaka, Tetsu [1 ,2 ]
机构：
[1] Tohoku Univ, Dept Mech Syst Engn, Aoba Ku, 6-6-12 Aramaki Aza Aoba, Sendai, Miyagi 9808579, Japan
[2] Tohoku Univ, Dept Biomed Engn, Aoba Ku, 6-6-12 Aramaki Aza Aoba, Sendai, Miyagi 9808579, Japan
[3] Tohoku Univ, Dept Mech & Aerosp Engn, Aoba Ku, 6-6-12 Aramaki Aza Aoba, Sendai, Miyagi 9808579, Japan
[4] Tohoku Univ, Frontier Res Inst Interdisciplinary Sci, Aoba Ku, 3 Aramaki Aza Aoba, Sendai, Miyagi 9808578, Japan
来源：
PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2019年
关键词：
D O I：
10.23919/ltb-3d.2019.8735115
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Impact of temporary bonding conditions and temporary adhesive properties on mechanical stresses in multichip thinning is evaluated for high-yield multichip-to-wafer (MC2W) heterogeneous 3D integration. It turned out that no sidewall covering of chips with a temporary adhesive gives low mechanical stress to the chip edge, leading to less chipping and cracking.
引用
收藏
页码：17 / 17
页数：1
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