Multichip alignment technology for 3D stack bonding and packaging

被引：0
|
作者：
Chen, Mingxiang [1 ,2 ]
Lü, Yaping [1 ]
Liu, Xiaogang [1 ]
Liu, Sheng [1 ,2 ]
机构：
[1] School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan,430074, China
[2] Division of MOEMS, Wuhan National Laboratory for Optoelectronics, Wuhan,430074, China
来源：
Huazhong Keji Daxue Xuebao (Ziran Kexue Ban)/Journal of Huazhong University of Science and Technology (Natural Science Edition) | 2015年 / 43卷 / 02期
关键词：
D O I：
10.13245/j.hust.150201
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学科分类号：
摘要：
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页码：1 / 5
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