Schottky Barrier Characteristic Analysis on 4H-SiC Schottky Barrier Diodes With Heavy Ion-Induced Degradation

被引:6
|
作者
Wu, Zhikang [1 ,2 ]
Bai, Yun [1 ]
Yang, Chengyue [1 ]
Lu, Jiang [1 ]
Yang, Liao [1 ,2 ]
Tang, Yidan [1 ]
Tian, Xiaoli [1 ]
Liu, Xinyu [1 ]
机构
[1] Chinese Acad Sci, Inst Microelect, Beijing 100029, Peoples R China
[2] Univ Chinese Acad Sci, Sch Microelect, Beijing 100049, Peoples R China
关键词
4H-SiC; barrier height; degradation; Gaussian distribution; irradiation; Schottky barrier diode (SBD); INHOMOGENEITIES; DAMAGE; IRRADIATION; MECHANISM; MOSFETS; SI;
D O I
10.1109/TNS.2022.3160181
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Leakage current of 1200-V 4H-SiC Schottky barrier diodes (SBDs) with different structures increased by various degrees after heavy-ion exposure. By taking I-V measurements in a range of 298 to 448 K, the voltage dependence of saturation current (I-0), barrier height (phi(B0)), and ideality factor (n) were obtained. The dependence of these parameters with temperature illustrates the Gaussian distribution of barrier height. The inhomogeneity of the Schottky barrier height (SBH) distribution was successfully described using a modified thermionic emission (TE) model with Gaussian distribution, and the average barrier height ((phi) over bar (B0)) was gained. The results show that the barrier height distribution of all SBDs remain unchanged after the irradiation which means heavy-ion exposure did not affect the Schottky barrier.
引用
收藏
页码:932 / 937
页数:6
相关论文
共 50 条
  • [41] A self-consistent modeling of 4H-SiC Schottky barrier diodes
    Tayet, Mazhar B.
    El-Shawarby, Ayman M.
    PROCEEDINGS OF THE 2007 INTERNATIONAL WORKSHOP ON THE PHYSICS OF SEMICONDUCTOR DEVICES: IWPSD-2007, 2007, : 138 - 141
  • [42] Study of 4H-SiC JBS Diodes Fabricated with Tungsten Schottky Barrier
    Berthou, M.
    Godignon, P.
    Montserrat, J.
    Millan, J.
    Planson, D.
    JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (12) : 2355 - 2362
  • [43] A perspective on leakage current induced by threading dislocations in 4H-SiC Schottky barrier diodes
    Huang, Jhong-Ren
    Chen, Ting-Wei
    Lee, Jian-Wei
    Huang, Chih-Fang
    Hong, Lu-Sheng
    MATERIALS LETTERS, 2022, 310
  • [44] Effects of ultraviolet illumination on 4H-SiC Schottky barrier diodes irradiated by swift heavy ions
    Lan, Fan
    Gong, Min
    Huang, Mingmin
    Li, Yun
    Wang, Shaomin
    Liu, Jie
    Sun, Youmei
    Zhai, Pengfei
    Ma, Yao
    Yang, Zhimei
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION B-BEAM INTERACTIONS WITH MATERIALS AND ATOMS, 2020, 465 : 6 - 10
  • [45] A DLTS analysis of alpha particle irradiated commercial 4H-SiC Schottky barrier diodes
    Ahmed, Mustafa A. M.
    Auret, F. D.
    Nel, J. M.
    Venter, Andre
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2024, 35 (27)
  • [46] Analysis of surface morphology at leakage current sources of 4H-SiC Schottky barrier diodes
    Katsuno, Takashi
    Watanabe, Yukihiko
    Fujiwara, Hirokazu
    Konishi, Masaki
    Naruoka, Hideki
    Morimoto, Jun
    Morino, Tomoo
    Endo, Takeshi
    APPLIED PHYSICS LETTERS, 2011, 98 (22)
  • [47] Barrier height analysis of metal/4H-SiC Schottky contacts
    Itoh, A
    Takemura, O
    Kimoto, T
    Matsunami, H
    SILICON CARBIDE AND RELATED MATERIALS 1995, 1996, 142 : 685 - 688
  • [48] The estimation and revision of barrier heights in 4H-SiC and 6H-SiC Schottky diodes
    Lee, YS
    Kim, DY
    Oh, JK
    Han, MK
    Choi, YI
    WIDE-BANDGAP SEMICONDUCTORS FOR HIGH POWER, HIGH FREQUENCY AND HIGH TEMPERATURE, 1998, 512 : 175 - 180
  • [49] Effect of surface passivation on breakdown voltages of 4H-SiC Schottky barrier diodes
    Kang, In Ho
    Na, Moon Kyong
    Seok, Ogyun
    Moon, Jeong Hyun
    Kim, H. W.
    Kim, Sang Cheol
    Bahng, Wook
    Kim, Nam Kyun
    Park, Him-Chan
    Yang, Chang Heon
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2017, 71 (10) : 707 - 710
  • [50] Demonstration of the first 10-kV 4H-SiC Schottky barrier diodes
    Zhao, JH
    Alexandrov, P
    Li, X
    IEEE ELECTRON DEVICE LETTERS, 2003, 24 (06) : 402 - 404