共 50 条
- [1] Analysis of flip-chip ball grid array underfill flow process INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2024, 134 (9-10): : 4851 - 4870
- [2] Large-Scale Flip-Chip Power Grid Reduction with Geometric Templates DESIGN, AUTOMATION & TEST IN EUROPE, 2013, : 1679 - 1682
- [5] Thermal fatigue analysis of the Flip-Chip assembly on the Polymer Stud Grid Array (PSGA™) package 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 823 - 829
- [6] Characterization of On-die Power Supply Noise in FCBGA (Flip-Chip Ball Grid Array) Packages 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 554 - 559
- [8] Effect of flip-chip ball grid array structure on capillary underfill flow Results in Engineering, 2024, 23