共 50 条
- [31] Reliability and Parametric Study on Chip Scale Package Under Board-Level Drop Test IMPACT: 2009 4TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, 2009, : 470 - 473
- [32] Interposer Connection Reliability using Double-Side Solder Bump for Board-Level Vertical Interconnection' 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 501 - 504
- [34] Electro-optical integration for VCSEL-based board-level optical chip-to-chip communication OPTICAL FIBERS AND THEIR APPLICATIONS 2017, 2017, 10325
- [36] Integrated waveguide microoptic elements for 3D routing in board-level optical interconnects PHOTONICS PACKAGING AND INTEGRATION VI, 2006, 6126
- [39] Optical-I/O packaging technology for chip- and board-level optical interconnects APOC 2002: ASIA-PACIFIC OPTICAL AND WIRELESS COMMUNICATIONS, OPTICAL SWITCHING AND OPTICAL INTERCONNECTION II, 2002, 4907 : 195 - 202
- [40] 1ST COMPLETE FUTUREBUS + CHIP SET OPENS DOOR FOR BOARD-LEVEL IMPLEMENTATIONS COMPUTER DESIGN, 1990, 29 (11): : 38 - &