ERFAN: Efficient Reconfigurable Fault-Tolerant Deflection Routing Algorithm for 3-D Network-on-Chip

被引:0
|
作者
Maabi, Somayeh [1 ]
Safaei, Farshad [1 ]
Rezaei, Amin [2 ]
Daneshtalab, Masoud [3 ,4 ]
Zhao, Dan [5 ]
机构
[1] Shahid Beheshti Univ, Fac Comp Sci & Engn, Tehran, Iran
[2] Univ Louisiana Lafayette, Lafayette, LA 70504 USA
[3] Malardalen Univ MDH, Vasteras, Sweden
[4] Royal Inst Technol KTH, Stockholm, Sweden
[5] Old Dominion Univ, Norfolk, VA USA
关键词
3-D NoC; Fault Tolerance; Deflection Routing Algorithm; TSV; Reliability; 3D;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
With degradation in transistors dimensions and complication of circuits, Three-Dimensional Network-on-Chip (3-D NoC) is presented as a promising solution in electronic industry. By increasing the number of system components on a chip, the probability of failure will increase. Therefore, proposing fault tolerance mechanisms is an important target in emerging technologies. In this paper, two efficient fault-tolerant routing algorithms for 3-D NoC are presented. The presented algorithms have significant improvement in performance parameters, in exchange for small area overhead. Simulation results show that even with the presence of faults, the network latency is decreased in comparison with state-of-the-art works. In addition, the network reliability is improved reasonably.
引用
收藏
页码:306 / 311
页数:6
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