Non-Contact Probes for On-Wafer Characterization of Sub-Millimeter-Wave Devices and Integrated Circuits

被引：45
|
作者：
Caglayan, Cosan [1 ]
Trichopoulos, Georgios C. [1 ]
Sertel, Kubilay [1 ]
机构：
[1] Ohio State Univ, Electrosci Lab, Columbus, OH 43212 USA
来源：
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2014年 / 62卷 / 11期
关键词：
Measurement techniques; millimeter-wave (mmW) measurements; mmW technology; sub-mmW measurements; sub-mmW propagation; sub-mmW technology;
D O I：
10.1109/TMTT.2014.2356176
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present a novel non-contact metrology approach for on-wafer characterization of sub-millimeter-wave devices, components, and integrated circuits. Unlike existing contact probes that rely on small metallic tips that make physical contact with the device on the chip, the new non-contact probes are based on electromagnetic coupling of vector network analyzer (VNA) test ports into the coplanar waveguide environment of integrated devices and circuits. Efficient signal coupling is achieved via a quasi-optical link between the VNA ports and planar antennas that are monolithically integrated with the test device. Experimental validation of the non-contact device metrology system is presented for the first time to demonstrate the accuracy and repeatability of proposed approach for the 325-500-GHz (WR2.2) and 500-750-GHz (WR1.5) bands.
引用
收藏
页码：2791 / 2801
页数：11
相关论文
共 50 条
  • [31] Non-Contact Probes for Device and Integrated Circuit Characterization in the THz and mmW Bands
    Caglayan, Cosan
    Trichopoulos, Georgios C.
    Sertel, Kubilay
    2014 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2014,
  • [32] De-embedding and Electromagnetic Simulation Calibration of On-wafer Passive Devices for Millimeter Wave Integrated Circuit Design Support
    Cao, Yang
    Zhang, Wei
    Fu, Jun
    Liu, Nianhong
    Wang, Quan
    Liu, Linlin
    2017 2ND IEEE INTERNATIONAL CONFERENCE ON INTEGRATED CIRCUITS AND MICROSYSTEMS (ICICM), 2017, : 53 - 56
  • [33] A novel method for millimeter-wave on-wafer characterization of reflect patch antennas
    Farinelli, Paola
    Vaha-Heikkila, Tauno
    Saily, Jussi
    Sorrentino, Roberto
    Tuovinen, Jussi
    IEEE ANTENNAS AND WIRELESS PROPAGATION LETTERS, 2006, 5 : 556 - 558
  • [34] Packaged photonic probes for an on-wafer broad-band millimeter-wave network analyzer
    Sahri, N
    Nagatsuma, T
    IEEE PHOTONICS TECHNOLOGY LETTERS, 2000, 12 (09) : 1225 - 1227
  • [35] Non-Contact Probing in Millimeter Wave Transmitter Characterizations
    Ding, Hanyi
    Szenher, Francis F.
    Feng, Kai
    Burnett, Randall M., II
    Paganini, Andrea
    Morton, Robert
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 809 - +
  • [36] Millimeter-Wave and Power Characterization for Integrated Circuits
    de Matos, M.
    Kerherve, E.
    Lapuyade, H.
    Begueret, J-B.
    Deval, Y.
    2009 EAEEIE ANNUAL CONFERENCE, 2009, : 107 - 110
  • [37] Device Characterization with Non-Contact Probes in the THz Band
    Caglayan, Cosan
    Trichopoulos, Georgios C.
    Sertel, Kubilay
    2013 US NATIONAL COMMITTEE OF URSI NATIONAL RADIO SCIENCE MEETING (USNC-URSI NRSM), 2013,
  • [38] Non-contact Millimeter Wave Dielectric Spectroscopy on Aqueous Solution
    Wu, Che Min
    Cheng, Chia Chin
    Yang, Shang Hua
    2023 48TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES, IRMMW-THZ, 2023,
  • [39] A W-Band Micromachined On-Wafer Probe With Integrated Balun for Characterization of Differential Circuits
    Zhang, Chunhu
    Bauwens, Matthew
    Barker, N. Scott
    Weikle, Robert M.
    Lichtenberger, Arthur W.
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2016, 64 (05) : 1585 - 1593
  • [40] Sub-millimeter Wave Active Imaging with Silicon Integrated Circuits
    Pfeiffer, U. R.
    2011 36TH INTERNATIONAL CONFERENCE ON INFRARED, MILLIMETER, AND TERAHERTZ WAVES (IRMMW-THZ), 2011,
12345