Wafer stacking : key technology for 3D integration

被引：0
|
作者：
Lagahe-Blanchard, C. [1 ]
Aspar, B. [1 ]
机构：
[1] SOITEC, F-38926 Crolles, France
来源：
2009 IEEE INTERNATIONAL SOI CONFERENCE | 2009年
关键词：
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
引用
收藏
页码：41 / 44
页数：4
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