Cryogenic Characterization of 16 nm FinFET Technology for Quantum Computing

被引:8
|
作者
Han, Hung-Chi [1 ]
Jazaeri, Farzan [1 ]
D'Amico, Antonio [1 ]
Baschirotto, Andrea [2 ]
Charbon, Edoardo [1 ]
Enz, Christian [1 ]
机构
[1] Ecole Polytech Fed Lausanne EPFL, Lausanne, Switzerland
[2] Univ Milano Bicocca, Milan, Italy
基金
欧盟地平线“2020”;
关键词
Tri-gate FinFET; Cryogenic CMOS; Quantum Computing; Compact Modeling; MOBILITY; CMOS;
D O I
10.1109/ESSDERC53440.2021.9631805
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This study presents the first in depth characterization of deep cryogenic electrical behavior of a commercial 16nm CMOS FinFET technology. This technology is well suited for a broad range of applications, including quantum computing, quantum sensing, and quantum communications. Cryogenic DC measurements and physical parameters extraction were carried out on this commercial FinFET technology, operating at room temperature, i.e., 300 K, and down to 2.95K for different device types and geometries. This represents the main step towards cryogenic compact modeling and optimization of three-dimensional CMOS structures for quantum computations.
引用
收藏
页码:71 / 74
页数:4
相关论文
共 50 条
  • [31] Hair-Like Nanostructure Based Ion Detector by 16nm FinFET Technology
    Wang, Chien-Ping
    Shen, Ying-Chun
    Liou, Kun-Lin
    Chueh, Yu-Lun
    Chih, Yue-Der
    Chang, Jonathan
    Shih, Jiaw-Ren
    Lin, Chrong Jung
    King, Ya-Chin
    2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY, 2020,
  • [32] Cryogenic CMOS for Quantum Processing: 5-nm FinFET-Based SRAM Arrays at 10 K
    Parihar, Shivendra Singh
    van Santen, Victor M.
    Thomann, Simon
    Pahwa, Girish
    Chauhan, Yogesh Singh
    Amrouch, Hussam
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2023, 70 (08) : 3089 - 3102
  • [33] Study of Layout effect on Gate oxide TDDB in sub-16nm FinFET technology
    Liu, Xiangyu
    Sun, Yongsheng
    Huang, Junlin
    Liu, Changze
    Shang, Xiaolu
    2021 IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2021,
  • [34] Detection and Mitigation of nBTI Aging of a High Precision Current Comparator in 16 nm FinFET Technology
    Sun, Hyuk
    Wilkins, Paul
    Rose, Steve
    Engel, Gil
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2025,
  • [35] Detectors Array for In Situ Electron Beam Imaging by 16-nm FinFET CMOS Technology
    Chien-Ping Wang
    Burn Jeng Lin
    Jiaw-Ren Shih
    Yue-Der Chih
    Jonathan Chang
    Chrong Jung Lin
    Ya-Chin King
    Nanoscale Research Letters, 16
  • [36] Embedded SRAM Designs for Enhancing Performance, Power and Area (PPA) in 16 nm FinFET Technology
    Nii, Koji
    Ishii, Yuichiro
    Yabuuchi, Makoto
    Sano, Toshiaki
    Morimoto, Masao
    Sawada, Yohei
    Tsukamoto, Yasumasa
    Tanaka, Miki
    Tanaka, Shinji
    2016 13TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2016, : 563 - 566
  • [37] Single-Event Effect Characterization of 16 GHz Phase-Locked Loop in Sub-20 nm FinFET Technology
    Sun, Hanhan
    Wu, Zirui
    Luo, Deng
    Liang, Bin
    Chen, Jianjun
    Chi, Yaqing
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2024, 71 (09) : 2077 - 2085
  • [38] Variability Evaluation of 28nm FD-SOI Technology at Cryogenic Temperatures down to 100mK for Quantum Computing
    Paz, B. Cardoso
    Le Guevel, L.
    Casse, M.
    Billiot, G.
    Pillonnet, G.
    Jansen, A. G. M.
    Maurand, R.
    Haendler, S.
    Juge, A.
    Vincent, E.
    Galy, P.
    Ghibaudo, G.
    Vinet, M.
    de Franceschi, S.
    Meunier, T.
    Gaillard, F.
    2020 IEEE SYMPOSIUM ON VLSI TECHNOLOGY, 2020,
  • [39] Investigation of TCADs Models for Characterization of Sub 16 nm In0.53Ga0.47As FinFET
    Pathak, J.
    Darji, A.
    VLSI DESIGN AND TEST, 2017, 711 : 279 - 286
  • [40] Reliability Analysis of FinFET-Based SRAM PUFs for 16nm, 14nm, and 7nm Technology Nodes
    Masoumian, Shayesteh
    Selimis, Georgios
    Wang, Rui
    Schrijen, Geert-Jan
    Hamdioui, Said
    Taouil, Mottaqiallah
    PROCEEDINGS OF THE 2022 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE 2022), 2022, : 1189 - 1192