Estimating Power Dissipation through Thermal Measurements in Power Circuits

被引：0
|
作者：
Fodor, A. [1 ]
Chindris, G. [1 ]
机构：
[1] Tech Univ Cluj Napoca, Appl Elect Dept, Cluj Napoca, Romania
来源：
2020 IEEE 26TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2020) | 2020年
关键词：
thermal modelling; power dissipation; power circuit;
D O I：
10.1109/siitme50350.2020.9292168
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In systems working in strongly distorted regimes, electrical measurements are insufficient for determining the total power dissipation. The study proposes an alternative method for estimating power dissipation in an electronic system in which thermal measurements are correlated with thermal modelling and simulations for a power circuit, to estimate power dissipation in the assembly. It is shown that modelling the component packages and measuring the temperature rise in a power system, the total power dissipation can be estimated.
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页码：372 / 375
页数：4
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