Application of hybrid evolutionary partitioning algorithm for heat transfer enhancement in VLSI circuits

被引：0
|
作者：
Koziel, S [1 ]
Szczesniak, W [1 ]
机构：
[1] Gdansk Univ Technol, Fac Elect Telecommun & Informat, PL-80952 Gdansk, Poland
来源：
1ST IEEE INTERNATIONAL CONFERENCE ON CIRCUITS AND SYSTEMS FOR COMMNICATIONS, PROCEEDINGS | 2002年
关键词：
thermal performance of interconnections; heat dissipation; heat transfer enhancement; layout of VLSI circuit; multichip modules; VLSI circuit partitioning; hybrid evolutionary VLSI partitioning;
D O I：
10.1109/OCCSC.2002.1029122
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the paper, a new approach to improving the beat transfer in integrated circuits (ICs) is presented. It is based on improving the thermal conductivity of ICs by increasing the number of their external connections up to the level determined by the packaging standards. To achieve this, a new Hybrid Evolutionary Partitioning Algorithm (HEPA) for circuit partitioning is introduced. The experimental results show that HEPA is able to reach optimal solutions in the case of bipartitioning problem, and almost optimal. in the case of k-way partitioning (k>2). The presented approach is especially dedicated for multichip modules and a flip chip interconnect technologies which are used in contemporary ICs.
引用
收藏
页码：386 / 389
页数：4
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