Hybrid evolutionary partitioning algorithm for heat transfer enhancement in VLSI circuits

被引：2
|
作者：
Koziel, S [1 ]
Szczesniak, W [1 ]
机构：
[1] Gdansk Univ Technol, Dept Elect Telecommun & Informat, PL-80952 Gdansk, Poland
来源：
MICROELECTRONICS JOURNAL | 2002年 / 33卷 / 09期
关键词：
thermal performance of interconnections; heat dissipation; heat transfer enhancement; layout of VLSI circuit; VLSI circuit partitioning; hybrid evolutionary VLSI partitioning;
D O I：
10.1016/S0026-2692(02)00058-7
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, a new approach to improving the heat transfer in integrated circuits (ICs) is presented. It is based on improving the thermal conductivity of ICs by increasing the number of their external connections up to the level determined by the packaging standard. In order to attain this goal, a new hybrid evolutionary partitioning algorithm (HEPA) for circuits partitioning is introduced. The computations carried out for the chosen benchmarks show that HEPA is able to reach optimal solutions in the case of bipartitioning problem, and almost optimal in the case of k-way partitioning (k > 2). The presented approach is especially dedicated for a flip chip interconnect technology which is used in contemporary ICs. (C) 2002 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码：739 / 746
页数：8
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