Electrical properties of Si:H/P-Si structures fabricated by hydrogen implantation

被引：6
|
作者：
Naumova, OV [1 ]
Antonova, IV [1 ]
Popov, VP [1 ]
Stas', VF [1 ]
机构：
[1] Russian Acad Sci, Inst Semicond Phys, Siberian Div, Novosibirsk 630090, Russia
来源：
SEMICONDUCTORS | 2003年 / 37卷 / 01期
关键词：
D O I：
10.1134/1.1538545
中图分类号：
O469 [凝聚态物理学];
学科分类号：
070205 ;
摘要：
Hydrogenated silicon (Si:H) layers and Si:H/p-Si heterostructures were produced by multiple-energy (3-24 keV) high-dose (5 x 10(16)-3 x 10(17) cm(-2)) hydrogen implantation into p-Si wafers. After implantation, current transport across the structures is controlled by the Poole-Frenkel mechanism, with the energy of the dominating emission center equal to E-c -0.89 eV. The maximum photosensitivity is observed for structures implanted with 3.2 x 10(17) cm(-2) of hydrogen and annealed in the temperature range of 250-300degreesC. The band gap of the Si:H layer E-g approximate to 2.4 eV, and the dielectric constant epsilon approximate to 3.2. The density of states near the Fermi level is (1-2) x 10(17) cm(-3) eV(-1). (C) 2003 MAIK "Nauka/Interperiodica".
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收藏
页码：92 / 96
页数：5
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