Analysis of slow-current transients or current collapse in AlGaN/GaN HEMTs with field plate and high-k passivation layer

被引:3
|
作者
Komoto, Kazuki [1 ]
Saito, Yasunori [1 ]
Tsurumaki, Ryouhei [1 ]
Horio, Kazushige [1 ]
机构
[1] Shibaura Inst Technol, Fac Syst Engn, Minuma Ku, 307 Fukasaku, Saitama 3378570, Japan
关键词
GaN HEMT; Current collapse; Drain lag; High-k passsivation layer; Field plate; 2D analysis; ELECTRON-MOBILITY TRANSISTORS; LAG PHENOMENA; GAN; SLUMP;
D O I
10.1016/j.microrel.2022.114552
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We study how the dielectric constant of passivation layer epsilon r and field-plate related parameters (its length LFP, passivation-layer thickness Ti) affect the reduction rates of drain current arising from drain lag, gate lag and current collapse in AlGaN/GaN HEMTs. We plot the current-reduction rates versus Ti for different epsilon r. It is indicated that depending on epsilon r, the drain-lag and current-collapse rates take minimum at certain Ti. When epsilon r is 7, 20, 30 and 50, the current-reduction rates become minimum at Ti = 0.03, 0.1, 0.1, and 0.2 mu m, respectively. Hence, at the minimum point, epsilon r/Ti which is proportional to capacitance of the passivation layer takes a nearly constant value at 250 +/- 50/mu m. At this value of Ti, the lags and current collapse are reduced when LFP becomes long for every epsilon r considered here.
引用
收藏
页数:9
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