Biocompatible silicon wafer bonding for biomedical microdevices

被引:7
|
作者
Hansford, D [1 ]
Desai, T [1 ]
Tu, J [1 ]
Ferrari, M [1 ]
机构
[1] Univ Calif Berkeley, Biomed Microdevices Ctr, Berkeley, CA 94720 USA
关键词
biocompatible; wafer bonding; adhesive; methacrylates;
D O I
10.1117/12.304376
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, several candidate bonding materials are reviewed for use in biomedical microdevices. These include poly propylmethacrylate (PPMA), poly methylmethacrylate (PMMA), a copolymer of poly (ethyl, butyl) methacrylate (PBEMA) and two types of silicone gels. They were evaluated based on their cytotoxicity and bond strength, as well as several other qualitative assessments. The cytotoxicity was determined through a cell growth assay protocol in which cells were grown on the various substrata and their growth was compared to cells sown on control substrata. The adhesive strength was assessed by using a pressurized plate test in which the adhesive interface was pressurized to failure, Ab of the substrata were found (once cured) to be non-cytotoxic in an inert manner except for the industrial silicone adhesive gel (Dow Coming 736). The adhesive strengths of the various materials are compared to each other and to previously published adhesive strengths. All of the materials were found to have a sufficient bonding strength for biomedical applications, but several other factors were determined that limit the use of each material (including defect density, patternability, and ease of application).
引用
收藏
页码:164 / 168
页数:5
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