Biocompatible silicon wafer bonding for biomedical microdevices

被引:7
|
作者
Hansford, D [1 ]
Desai, T [1 ]
Tu, J [1 ]
Ferrari, M [1 ]
机构
[1] Univ Calif Berkeley, Biomed Microdevices Ctr, Berkeley, CA 94720 USA
关键词
biocompatible; wafer bonding; adhesive; methacrylates;
D O I
10.1117/12.304376
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, several candidate bonding materials are reviewed for use in biomedical microdevices. These include poly propylmethacrylate (PPMA), poly methylmethacrylate (PMMA), a copolymer of poly (ethyl, butyl) methacrylate (PBEMA) and two types of silicone gels. They were evaluated based on their cytotoxicity and bond strength, as well as several other qualitative assessments. The cytotoxicity was determined through a cell growth assay protocol in which cells were grown on the various substrata and their growth was compared to cells sown on control substrata. The adhesive strength was assessed by using a pressurized plate test in which the adhesive interface was pressurized to failure, Ab of the substrata were found (once cured) to be non-cytotoxic in an inert manner except for the industrial silicone adhesive gel (Dow Coming 736). The adhesive strengths of the various materials are compared to each other and to previously published adhesive strengths. All of the materials were found to have a sufficient bonding strength for biomedical applications, but several other factors were determined that limit the use of each material (including defect density, patternability, and ease of application).
引用
收藏
页码:164 / 168
页数:5
相关论文
共 50 条
  • [31] Silicon-to-silicon wafer bonding using evaporated glass
    Weichel, S
    de Reus, R
    Lindahl, M
    SENSORS AND ACTUATORS A-PHYSICAL, 1998, 70 (1-2) : 179 - 184
  • [32] Miniaturization and Biocompatible Encapsulation for Implantable Biomedical Silicon Devices
    Souriau, J-C.
    Morales, J. M. Herrera
    Castagne, L.
    Simon, G.
    Amara, K.
    Boutaud, B.
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2015, 4 (12) : P445 - P450
  • [33] Thin film sputtered silicon for silicon wafer bonding applications
    Hurley, RE
    Gamble, HS
    VACUUM, 2003, 70 (2-3) : 131 - 140
  • [34] Low temperature silicon wafer-to-wafer bonding with nickel silicide
    Xiao, ZX
    Wu, GY
    Zhang, GB
    Li, ZH
    Hao, YL
    Chen, WR
    Wang, YY
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1998, 145 (04) : 1360 - 1362
  • [35] Effects of wafer cleaning and annealing on glass/silicon wafer direct bonding
    Min, HS
    Joo, YC
    Song, OS
    JOURNAL OF ELECTRONIC PACKAGING, 2004, 126 (01) : 120 - 123
  • [36] The influence of wafer dimensions on the contact wave velocity in silicon wafer bonding
    Bengtsson, S
    Ljungberg, K
    Vedde, J
    APPLIED PHYSICS LETTERS, 1996, 69 (22) : 3381 - 3383
  • [37] Characterization of vapor deposited thin silane films on silicon substrates for biomedical microdevices
    Popat, KC
    Robert, RW
    Desai, TA
    SURFACE & COATINGS TECHNOLOGY, 2002, 154 (2-3): : 253 - 261
  • [38] WHAT DETERMINES THE LATERAL BONDING SPEED IN SILICON-WAFER BONDING
    GOSELE, U
    HOPFE, S
    LI, S
    MACK, S
    MARTINI, T
    REICHE, M
    SCHMIDT, E
    STENZEL, H
    TONG, QY
    APPLIED PHYSICS LETTERS, 1995, 67 (06) : 863 - 865
  • [39] Silicon carbide wafer bonding by modified surface activated bonding method
    Suga, Tadatomo
    Mu, Fengwen
    Fujino, Masahisa
    Takahashi, Yoshikazu
    Nakazawa, Haruo
    Iguchi, Kenichi
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2015, 54 (03)
  • [40] Amorphous Silicon Carbide as a Non-Biofouling Structural Material for Biomedical Microdevices
    Zorman, C.
    Eldridge, A.
    Du, J.
    Johnston, M.
    Dubnisheva, A.
    Manley, S.
    Fissell, W.
    Fleischman, A.
    Roy, S.
    SILICON CARBIDE AND RELATED MATERIALS 2011, PTS 1 AND 2, 2012, 717-720 : 537 - +