High power 2.5D integrated thermoelectric generators combined with microchannels technology

被引:1
|
作者
Savelli, Guillaume [1 ]
Colonna, Jean-Philippe [2 ]
Coudrain, Perceval [2 ]
Faucherand, Pascal [1 ]
Royer, Agnes [2 ]
Collin, Louis-Michel [3 ]
Amnache, Amrid [3 ]
Frechette, Luc [3 ]
机构
[1] Univ Grenoble Alpes, CEA, Liten, DTNM, 17 Ave Martyrs, F-38000 Grenoble, France
[2] Univ Grenoble Alpes, CEA, Leti, DCOS, 17 Ave Martyrs, F-38000 Grenoble, France
[3] Univ Sherbrooke, LN2,Bld Univ 3000, Sherbrooke J1K OA5, PQ, Canada
基金
欧盟地平线“2020”;
关键词
Thermoelectric generators; Energy harvesting; SiGe; Microchannel; CMOS compatible;
D O I
10.1016/j.energy.2022.123984
中图分类号
O414.1 [热力学];
学科分类号
摘要
We have developed high power integrated thermoelectric generators (mu TEGs). These mu TEGs are CMOS compatible, i.e. based on polycristalline SiGe materials. These mu TEGs have been processed directly on a silicon interposer. Even if poly-SiGe exhibits low thermoelectric performances at room temperature, the specific design and proposed architecture enable mu TEGs to deliver up to 680 mu W for a temperature difference at 15.5 K. To reach such high power, an original 2.5D structure has been developed and mu channels technology has been associated, below the mu TEG, to dissipate heat coming from the hot side. mu TEGs have been tested in real environment, located below a hot test chip. Such mu TEG performances overtake those from similar state-of-the-art CMOS compatible devices, and pave the way for a potential use in different applications such as sensors power supply or battery charger. (c) 2022 Elsevier Ltd. All rights reserved.
引用
收藏
页数:8
相关论文
共 50 条
  • [1] Metal-based folded-thermopile for 2.5D micro-thermoelectric generators
    Bel-Hadj, Ibrahim
    Bougrioua, Zahia
    Ziouche, Katir
    SENSORS AND ACTUATORS A-PHYSICAL, 2023, 349
  • [2] Thermal Isolation Within High-Power 2.5D Heterogenously Integrated Electronic Packages
    Fish, Michael
    McCluskey, Patrick
    Bar-Cohen, Avram
    2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2016, : 1847 - 1855
  • [3] HCAPP: Scalable Power Control for Heterogeneous 2.5D Integrated Systems
    Straube, Kramer
    Lowe-Power, Jason
    Nitta, Christopher
    Farrens, Matthew
    Akella, Venkatesh
    PROCEEDINGS OF THE 49TH INTERNATIONAL CONFERENCE ON PARALLEL PROCESSING, ICPP 2020, 2020,
  • [4] Thermal Analysis of 2.5D Package in High Power Application
    Han, Yong
    Li, Hongyu
    Lim, Sharon Seow Huang
    Kawano, Masaya
    2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2019, : 402 - 405
  • [5] TSV Technology for 2.5D IC Solution
    Wang, Meng-Jen
    Hung, Chang-Ying
    Kao, Chin-Li
    Lee, Pao-Nan
    Chen, Chi-Han
    Hung, Chih-Pin
    Tong, Ho-Ming
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 284 - 288
  • [6] Inductance Model of a Backside Integrated Power Inductor in 2.5D/3D Integration
    Qian, Kefang
    Qian, Libo
    APPLIED SCIENCES-BASEL, 2020, 10 (22): : 1 - 9
  • [7] High Bandwidth Low Power 2.5D Interconnect Modeling and Design
    Ding, Qian
    Liu, Hui
    Yew, Yee Huan
    Jiang, Jenny
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1832 - 1837
  • [8] Low-noise Design for Power Delivery Network in 2.5D Integrated Microsystem
    Wang, Yanling
    Yang, Qiao
    Zhao, Liang
    Li, Baoxia
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [9] Material Technology for 2.5D/3D Package
    Mitsukura, Kazuyuki
    Makino, Tatsuya
    Hatakeyama, Keiichi
    Rebibis, Kenneth June
    Wang, Teng
    Capuz, Giovanni
    Duval, Fabrice
    Detalle, Mikael
    Miller, Andy
    Beyne, Eric
    IEEE CPMT SYMPOSIUM JAPAN 2015, (ICSJ 2015), 2015, : 101 - 104
  • [10] Silicon integrated circuit thermoelectric generators with a high specific power generation capacity
    Gangyi Hu
    Hal Edwards
    Mark Lee
    Nature Electronics, 2019, 2 : 300 - 306