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- [24] Failure Analysis of a 2.5D stacking using μ insert technology PROCEEDINGS OF THE 2013 20TH IEEE INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2013), 2013, : 427 - 432
- [25] Effects of Temperature on the Adhesive Performance of High Tg Underfill in 2.5D Heterogeneous Integrated Packaging IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 2275 - 2280
- [26] Advanced Processing for High Efficiency Inductors for 2.5D/3D Power Supply in Package 2014 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2014,
- [27] Signal and Power Integrity Analysis in 2.5D Integrated Circuits (ICs) with Glass, Silicon and Organic Interposer 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 738 - 743
- [28] Technology Trends in 2.5D/3D Packaging and Heterogeneous Integration 2021 5TH IEEE ELECTRON DEVICES TECHNOLOGY & MANUFACTURING CONFERENCE (EDTM), 2021,
- [29] 2.5D and 3D Technology Challenges and Test Vehicle Demonstrations 2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1068 - 1076
- [30] Invited Talk 2.5D and 3D Technology Advancements for Systems 2013 IEEE WORKSHOP ON MICROELECTRONICS AND ELECTRON DEVICES (WMED), 2013, : XIV - XV