High power 2.5D integrated thermoelectric generators combined with microchannels technology

被引:1
|
作者
Savelli, Guillaume [1 ]
Colonna, Jean-Philippe [2 ]
Coudrain, Perceval [2 ]
Faucherand, Pascal [1 ]
Royer, Agnes [2 ]
Collin, Louis-Michel [3 ]
Amnache, Amrid [3 ]
Frechette, Luc [3 ]
机构
[1] Univ Grenoble Alpes, CEA, Liten, DTNM, 17 Ave Martyrs, F-38000 Grenoble, France
[2] Univ Grenoble Alpes, CEA, Leti, DCOS, 17 Ave Martyrs, F-38000 Grenoble, France
[3] Univ Sherbrooke, LN2,Bld Univ 3000, Sherbrooke J1K OA5, PQ, Canada
基金
欧盟地平线“2020”;
关键词
Thermoelectric generators; Energy harvesting; SiGe; Microchannel; CMOS compatible;
D O I
10.1016/j.energy.2022.123984
中图分类号
O414.1 [热力学];
学科分类号
摘要
We have developed high power integrated thermoelectric generators (mu TEGs). These mu TEGs are CMOS compatible, i.e. based on polycristalline SiGe materials. These mu TEGs have been processed directly on a silicon interposer. Even if poly-SiGe exhibits low thermoelectric performances at room temperature, the specific design and proposed architecture enable mu TEGs to deliver up to 680 mu W for a temperature difference at 15.5 K. To reach such high power, an original 2.5D structure has been developed and mu channels technology has been associated, below the mu TEG, to dissipate heat coming from the hot side. mu TEGs have been tested in real environment, located below a hot test chip. Such mu TEG performances overtake those from similar state-of-the-art CMOS compatible devices, and pave the way for a potential use in different applications such as sensors power supply or battery charger. (c) 2022 Elsevier Ltd. All rights reserved.
引用
收藏
页数:8
相关论文
共 50 条
  • [41] Non-orthogonal 2.5D PEEC for Power Integrity Analysis
    Nayak, Bibhu Prasad
    Vedicherla, Sreenivasulu Reddy
    Gope, Dipanjan
    2015 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM, 2015, : 174 - 177
  • [42] Validating and Characterizing a 2.5D High Bandwidth Memory SubSystem
    Menon, Sreeja
    Murugan, Vinod Inipodu
    2020 IEEE INTERNATIONAL TEST CONFERENCE INDIA (ITC INDIA), 2020, : 46 - 54
  • [43] Spin coating and plasma process for 2.5D integrated photonics on multilayer polymers
    Zebda, A.
    Camberlein, L.
    Beche, B.
    Gaviot, E.
    Beche, E.
    Duval, D.
    Zyss, J.
    Jezequel, G.
    Solal, F.
    Godet, C.
    THIN SOLID FILMS, 2008, 516 (23) : 8668 - 8674
  • [44] A Scalable Network-on-Chip Microprocessor With 2.5D Integrated Memory and Accelerator
    Manoj, Sai P. D.
    Lin, Jie
    Zhu, Shikai
    Yin, Yingying
    Liu, Xu
    Huang, Xiwei
    Song, Chongshen
    Zhang, Wenqi
    Yan, Mei
    Yu, Zhiyi
    Yu, Hao
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, 2017, 64 (06) : 1432 - 1443
  • [45] The interfacial reliability of through-glass vias for 2.5D integrated circuits
    Ahmed, Omar
    Jalilvand, Golareh
    Pollard, Scott
    Okoro, Chukwudi
    Jiang, Tengfei
    MICROELECTRONICS INTERNATIONAL, 2020, 37 (04) : 181 - 188
  • [46] SIGNAL AND POWER INTEGRITY DESIGN OF 2.5D HBM (HIGH BANDWIDTH MEMORY MODULE) ON SI INTERPOSER
    Cho, Kyungjun
    Lee, Hyunsuk
    Kim, Joungho
    2016 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC), 2016,
  • [47] Testing of Interposer-Based 2.5D Integrated Circuits: Challenges and Solutions
    Wang, Ran
    Chakrabarty, Krishnendu
    2016 IEEE 25TH ASIAN TEST SYMPOSIUM (ATS), 2016, : 74 - 79
  • [48] Silicon Photonic 2.5D Integrated Multi-Chip Module Receiver
    Abrams, Nathan C.
    Cheng, Qixiang
    Glick, Madeleine
    Jezzini, Moises
    Morrissey, Padraic
    O'Brien, Peter
    Bergman, Keren
    2020 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO), 2020,
  • [49] Combined 3D and 2.5D modeling of the floating zone process with Comsol Multiphysics
    Wuenscher, Michael
    Menzel, Robert
    Riemann, Helge
    Luedge, Anke
    JOURNAL OF CRYSTAL GROWTH, 2014, 385 : 100 - 105
  • [50] Low Cost, High Performance, and High Reliability 2.5D Silicon Interposer
    Sundaram, Venky
    Chen, Qiao
    Wang, Tao
    Lu, Hao
    Suzuki, Yuya
    Smet, Vanessa
    Kobayashi, Makoto
    Pulugurtha, Raj
    Tummala, Rao
    2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 342 - 347