Flip-chip BGA assembly process and reliability improvements

被引：1
|
作者：
Thompson, P [1 ]
Koehler, C [1 ]
Petras, M [1 ]
Solis, C [1 ]
机构：
[1] MOTOROLA INC,ADV INTERCONNECT SYST LAB,SCHAUMBURG,IL 60196
来源：
NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM | 1996年
关键词：
D O I：
10.1109/IEMT.1996.559690
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：84 / 90
页数：7
相关论文
共 50 条
  • [1] Comparing the impacts of the capillary and the molded underfill process on the reliability of the flip-chip BGA
    Chen, K. A.
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2008, 31 (03): : 586 - 591
  • [2] Reliability evaluation of underfill in flip-chip organic BGA packages
    Banks, DR
    Pofahl, RG
    Sylvester, MF
    1997 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1997, 3235 : 124 - 125
  • [3] Flip-Chip Process Improvements for Low Warpage
    Hubbard, Robert L.
    Zappella, Pierino
    Zhu, Pukun
    2010 PROCEEDINGS 60TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2010, : 25 - 30
  • [4] Microspring Characterization and Flip-Chip Assembly Reliability
    Cheng, Bowen
    De Bruyker, Dirk
    Chua, Chris
    Sahasrabuddhe, Kunal
    Shubin, Ivan
    Cunningham, John E.
    Luo, Ying
    Boehringer, Karl F.
    Krishnamoorthy, Ashok V.
    Chow, Eugene M.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2013, 3 (02): : 187 - 196
  • [5] Thermal characterization of flip-chip BGA
    Chen, HN
    Wu, CT
    Lin, PJ
    Hung, SC
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 357 - 361
  • [6] Experimental and Numerical Investigations on Solder Reliability for Flip-Chip BGA Packaging
    Chen, Ching-, I
    Lee, Cheng-Chung
    Ni, Ching-Yu
    IEEE/SOLI'2008: PROCEEDINGS OF 2008 IEEE INTERNATIONAL CONFERENCE ON SERVICE OPERATIONS AND LOGISTICS, AND INFORMATICS, VOLS 1 AND 2, 2008, : 2756 - +
  • [7] Reliability study of high-pin-count flip-chip BGA
    Li, Y
    Xie, J
    Verma, T
    Wang, V
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 276 - 280
  • [8] No-clean assembly process conditions - Effects on flip-chip/underfill reliability
    Todd, M
    Costello, K
    INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2001, : 42 - 45
  • [9] FLIP-CHIP ASSEMBLY
    HUGLE, WB
    BAMBERG, JL
    PEDROTTI, DG
    SOLID STATE TECHNOLOGY, 1969, 12 (08) : 62 - &
  • [10] Assembly and reliability of "large die" flip-chip chip scale packages
    Gaffney, K
    Erich, R
    2001 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, PROCEEDINGS, 2001, 4428 : 137 - 142
12345