Flip-chip BGA assembly process and reliability improvements

被引：1
|
作者：
Thompson, P [1 ]
Koehler, C [1 ]
Petras, M [1 ]
Solis, C [1 ]
机构：
[1] MOTOROLA INC,ADV INTERCONNECT SYST LAB,SCHAUMBURG,IL 60196
来源：
NINETEENTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM - PROCEEDINGS, 1996 IEMT SYMPOSIUM | 1996年
关键词：
D O I：
10.1109/IEMT.1996.559690
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：84 / 90
页数：7
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