Feasibility of Single Wire Communication for PCB-level Interconnects

被引:0
|
作者
Kotethota, Skanda [1 ]
Hada, Gaurav [2 ]
Ramaswamy, Parthasarathy [2 ]
Gope, Dipanjan [1 ]
机构
[1] Indian Inst Sci, Dept Elect Commun Engn, Bangalore, Karnataka, India
[2] Intel Corp, Bangalore, Karnataka, India
关键词
Single Wire Transmission; Surface waves; Printed Circuit Board (PCB); Crosstalk;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
In this paper, the applicability of Single Wire Communication (SWC) is explored for Printed Circuit Board (PCB) interconnects. Traditionally quasi-TEM mode based multi-conductor transmission lines like microstrip or stripline configurations have been employed for PCB applications with a ground plane for current return. At high frequencies, approaching 50GHz and more, the insertion profile of quasi-TEM transmission suffers primarily due to dielectric loss. On the other hand, due to TM mode of propagation SWC presents a viable low-loss communication alternative at such high frequencies. In this work, some of the challenges of practical implementation for SWC, including planar launchers and mitigating cross-talk effects, are studied and the relative advantages over microstrip transmission is demonstrated.
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页数:4
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