Feasibility of Single Wire Communication for PCB-level Interconnects

被引:0
|
作者
Kotethota, Skanda [1 ]
Hada, Gaurav [2 ]
Ramaswamy, Parthasarathy [2 ]
Gope, Dipanjan [1 ]
机构
[1] Indian Inst Sci, Dept Elect Commun Engn, Bangalore, Karnataka, India
[2] Intel Corp, Bangalore, Karnataka, India
关键词
Single Wire Transmission; Surface waves; Printed Circuit Board (PCB); Crosstalk;
D O I
暂无
中图分类号
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号
0807 ; 0820 ;
摘要
In this paper, the applicability of Single Wire Communication (SWC) is explored for Printed Circuit Board (PCB) interconnects. Traditionally quasi-TEM mode based multi-conductor transmission lines like microstrip or stripline configurations have been employed for PCB applications with a ground plane for current return. At high frequencies, approaching 50GHz and more, the insertion profile of quasi-TEM transmission suffers primarily due to dielectric loss. On the other hand, due to TM mode of propagation SWC presents a viable low-loss communication alternative at such high frequencies. In this work, some of the challenges of practical implementation for SWC, including planar launchers and mitigating cross-talk effects, are studied and the relative advantages over microstrip transmission is demonstrated.
引用
收藏
页数:4
相关论文
共 50 条
  • [41] Deterministic secure quantum communication using a single d-level system
    Jiang, Dong
    Chen, Yuanyuan
    Gu, Xuemei
    Xie, Ling
    Chen, Lijun
    SCIENTIFIC REPORTS, 2017, 7
  • [42] Single-cell level co-culture platform for intercellular communication
    Hong, Soongweon
    Pan, Qiong
    Lee, Luke P.
    INTEGRATIVE BIOLOGY, 2012, 4 (04) : 374 - 380
  • [43] Deterministic secure quantum communication using a single d-level system
    Dong Jiang
    Yuanyuan Chen
    Xuemei Gu
    Ling Xie
    Lijun Chen
    Scientific Reports, 7
  • [44] High Impedance Fault Characterization on Single-Wire Earth Return Systems using Powerline Communication
    Sumaya, Ryan Jose
    Mo, Huadong
    Dong, Daoyi
    Pota, Hemanshu
    2022 IEEE PES 14TH ASIA-PACIFIC POWER AND ENERGY ENGINEERING CONFERENCE, APPEEC, 2022,
  • [45] A Wideband mmWave Antenna in Fan-Out Wafer Level Packaging With Tall Vertical Interconnects for 5G Wireless Communication
    Yu, Bin
    Qian, Zhanyi
    Lin, Chengchung
    Lin, Johnson
    Zhang, Yueping
    Yang, Guangli
    Luo, Yong
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 2021, 69 (10) : 6906 - 6911
  • [46] Feasibility Study of Microneedle Fabrication from a thin Nitinol Wire Using a CW Single-Mode Fiber Laser
    Tu, Jay
    Reeves, Nicolas
    OPEN ENGINEERING, 2019, 9 (01): : 167 - 177
  • [47] Performance analysis of a single-wire capacitance sensor for interface level measurement in stratified multiphase flows
    Atkinson, Colin
    Huang, Songming
    Meredith, Andrew
    FLOW MEASUREMENT AND INSTRUMENTATION, 2022, 85
  • [48] Further technical study for single wire protocol (SWP) in communication networks implementing NFC related mobile payment
    Liu, Jinxing
    Cao, Yuqiong
    Li, Wei
    Zheng, Haixia
    2015 3rd International Symposium on Computer, Communication, Control and Automation (3CA 2015), 2015, : 99 - 102
  • [49] SRRT: An Ultra-Low-Power Unidirectional Single-Wire Inter-Chip Communication for IoT
    Cong, Jiaxu
    Wang, Jingyu
    Tong, Bin
    Shang, Delong
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2025, 72 (01) : 128 - 132
  • [50] OPTIMAL SEQUENCING AND ARRANGEMENT IN DISTRIBUTED SINGLE-LEVEL TREE NETWORKS WITH COMMUNICATION DELAYS
    BHARADWAJ, V
    GHOSE, D
    MANI, V
    IEEE TRANSACTIONS ON PARALLEL AND DISTRIBUTED SYSTEMS, 1994, 5 (09) : 968 - 976