Environmental Influence on Fracture and Delamination of Electrically Conductive Adhesives

被引：0
|
作者：
Springer, Martin [1 ]
Bosco, Nick [1 ]
机构：
[1] Natl Renewable Energy Lab, Golden, CO 80401 USA
来源：
2020 47TH IEEE PHOTOVOLTAIC SPECIALISTS CONFERENCE (PVSC) | 2020年
关键词：
electrically conductive adhesives; photovoltaic; debonding; fracture mechanics; environmental conditions;
D O I：
10.1109/pvsc45281.2020.9300480
中图分类号：
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号：
0807 ; 0820 ;
摘要：
This paper presents our continued work on developing a degradation model for electrically conductive adhesive (ECA) interconnects in photovoltaic modules. Here, we characterize the fracture mechanics properties of an epoxy based ECA, for both critical and subcritical loading conditions. Emphasis is put on the influence of different environmental conditions such as temperature and humidity. We found that high levels of humidity not only weaken the adhesive joint but also promote subcritical debonding at significantly lower driving forces than in dry environments.
引用
收藏
页码：1110 / 1113
页数：4
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