High frequency interconnections using electrically conductive adhesives

被引：0
|
作者：
Dernevik, M [1 ]
Liu, J [1 ]
Starski, P [1 ]
机构：
[1] Chalmers Univ Technol, S-41296 Gothenburg, Sweden
来源：
MIKON-98: 12TH INTERNATIONAL CONFERENCE ON MICROWAVES & RADAR, VOLS 1-4 | 1998年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Results from measurements and simulation of high frequency interconnections are used to obtain an electrical model of the adhesive joint based on the physical parameters involved.
引用
收藏
页码：680 / 683
页数：4
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