Electrically conductive adhesives for electronic packaging and assembly applications

被引:15
|
作者
Matienzo, L. J. [1 ]
Das, R. N. [1 ]
Egitto, F. D. [1 ]
机构
[1] Endicott Interconnect Technol Inc, Endicott, NY 13760 USA
关键词
electrically conductive adhesives (ECAs); electronic packaging; sintering; materials characterization;
D O I
10.1163/156856108X305444
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
Some recent advances in materials, structures and properties that affect the mechanical and electrical characteristics and reliability performance of electrically conductive adhesives (ECAs) are discussed. This is done in the context of electronic packaging and assembly applications. Micro-silver-filled epoxy ECAs (with an average silver particle size of 5 pin) modified by addition of a conducting polymer, low melting point (LMP) alloys, or nanoparticles (average particle size of 80 nm) are described and compared with respect to volume resistivity, tensile strength and adhesion to copper. To understand the conduction and sintering behaviors of the various ECA formulations, SEM, optical microscopy and X-ray photoelectron spectroscopy (XPS) are used to investigate the micro-structure and chemical nature of the cured ECAs. Volume resistivity of the specially formulated adhesives is in the range of 10(-4) to 10(-6) Ohm cm. Adhesives formulated with a conducting polymer exhibit the greatest tensile strength with copper when compared to the other formulations investigated. The conducting polymer-modified ECA exhibited electrical conductivity on the order of that achieved with conventional ECAs. Hence, good electrical performance is achieved concurrent with superior mechanical properties. It was found that with increasing curing temperature, the volume resistivity of all ECAs decreased. This is attributed to sintering of metal particles at higher temperatures. Incorporation of nanoparticles reduces sintering temperature. Sintering of ECAs with micrometer-scale silver particles was further evaluated using high temperature/pressure lamination. A continuous metallic network resulted when the lamination temperature was greater than 300 degrees C. Electrical stability of ECA joints with aluminum was evaluated by stress testing in an environment of elevated temperature and humidity. A thin layer of silane-based coupling agent on the aluminum surfaces retards the degradation of the electrical properties of the joint. In general, proper preparation of the metal surface to which an ECA is mated is critical for maintaining both electrical and mechanical performances. (C) Koninklijke Brill NV, Leiden, 2008.
引用
下载
收藏
页码:853 / 869
页数:17
相关论文
共 50 条
  • [1] Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging
    Cui, Hui-wang
    Fan, Qiong
    Li, Dong-sheng
    Tang, Xin
    JOURNAL OF ADHESION, 2013, 89 (01): : 19 - 36
  • [2] Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
    Yim, Byung-Seung
    Kwon, Yumi
    Oh, Seung Hoon
    Kim, Jooheon
    Shin, Yong-Eui
    Lee, Seong Hyuk
    Kim, Jong-Min
    MICROELECTRONICS RELIABILITY, 2012, 52 (06) : 1165 - 1173
  • [3] Electrically Conductive Adhesives in Microelectronics Packaging
    Ayalasomayajula, Mukund
    Khurana, Mohit Ravi
    Chaudhary, Prince Shiva
    Journal of Electronic Packaging, 2024, 146 (04)
  • [4] High Temperature Performance of Low Stress Electrically Conductive Adhesives in Electronic Applications
    Dreezen, G.
    Theunissen, L.
    Luyckx, G.
    Dooling, P.
    Borak, A.
    2008 IEEE CONFERENCE ON POLYMERS AND ADHESIVES IN MICROELECTRONICS AND PHOTONICS AND 2008 IEEE INTERDISCIPLINARY CONFERENCE ON PORTABLE INFORMATION DEVICES, 2008, : 126 - +
  • [5] Study on bonding reliability of electrically conductive adhesives for microelectronics packaging
    Gao, Lilan
    Chen, Xu
    Guti Lixue Xuebao/Acta Mechanica Solida Sinica, 2010, 31 (06): : 631 - 642
  • [6] High performance electrically conductive epoxy/reduced graphene oxide adhesives for electronics packaging applications
    Ruchi Aradhana
    Smita Mohanty
    Sanjay Kumar Nayak
    Journal of Materials Science: Materials in Electronics, 2019, 30 : 4296 - 4309
  • [7] High performance electrically conductive epoxy/reduced graphene oxide adhesives for electronics packaging applications
    Aradhana, Ruchi
    Mohanty, Smita
    Nayak, Sanjay Kumar
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (04) : 4296 - 4309
  • [8] SILVER FLAKES FILLED INTERPENETRATING POLYMER NETWORK : HIGH PERFORMANCE ELECTRICALLY CONDUCTIVE ADHESIVES FOR ELECTRONIC PACKAGING
    Han, Yankang
    Zhang, Baotan
    Zhu, Pengli
    Huang, Shulei
    Sun, Rong
    Wong, Chingping
    2016 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2016,
  • [9] Novel Isotropical Conductive Adhesives for Electronic Packaging Application
    Tao, Yu
    Xia, Yanping
    Wang, Hui
    Gong, Fanghong
    Wu, Haiping
    Tao, Guoliang
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (03): : 589 - 592
  • [10] Electrically conductive adhesives
    Gordon, Rachel
    Coating International, 2016, 49 (03): : 10 - 11