Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging

被引：24
|
作者：
Yim, Byung-Seung [1 ]
Kwon, Yumi [2 ]
Oh, Seung Hoon [1 ]
Kim, Jooheon [2 ]
Shin, Yong-Eui [1 ]
Lee, Seong Hyuk [1 ]
Kim, Jong-Min [1 ]
机构：
[1] Chung Ang Univ, Sch Mech Engn, Seoul 156756, South Korea
[2] Chung Ang Univ, Sch Chem Engn & Mat Sci, Seoul 156756, South Korea
来源：
MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 06期
关键词：
POINT ALLOY FILLERS; SELF-ORGANIZED INTERCONNECTION; DENSITY; JOINT; FILM;
D O I：
10.1016/j.microrel.2011.12.004
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This study investigated the effect of the viscosity of the ECAs using a low-melting-point alloy (LMPA) filler on its bonding characteristics. The curing behaviors of the ECAs were determined using Differential Scanning Calorimetry (DSC), and ECA temperature-dependant viscosity characteristics were observed using a torsional parallel rheometer. The wetting test was conducted to investigate the reduction capability of ECAs and the flow-coalescence-wetting behavior of the LMPAs in ECAs. Electrical and mechanical properties were determined and compared to those with commercial ECAs and eutectic tin/lead (Sn/Pb) solder. In the metallurgically interconnected Quad Flat Package (QFP) joint, a typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper SnBi/Cu interface after curing process. On the other hand, a (Cu, Ni)(6)Sn-5 IMC layer formed on the SnBi/ENIG interface. In addition, the fracture surface exhibited by cleavage fracture mode and the fracture was propagated along the Cu-Sn IMC/SnBi interface. The extremely low-level viscosity of ECAs had a significant influence on the flow-coalescence-wetting behavior of the LMPAs in ECAs and also on the interconnection properties. Stable interconnected assemblies showed good electrical and mechanical properties. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1165 / 1173
页数：9
相关论文
共 50 条
  • [1] An investigation on wetting characteristics of solder particle for solderable electrically conductive adhesives (ECAs)
    Kim, J. M.
    Yang, K. C.
    Lee, S. B.
    Lee, S. H.
    Shin, Y. E.
    Chang, K. H.
    Han, J. G.
    Eom, Y. S.
    Moon, J. T.
    Baek, J. W.
    Nam, J. D.
    [J]. ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY, 2008, 580-582 : 217 - +
  • [2] Fundamental study of electrically conductive adhesives (ECAs)
    Wong, CP
    Lu, DQ
    Meyers, L
    Vona, SA
    Tong, QK
    [J]. PEP '97 : THE FIRST IEEE INTERNATIONAL SYMPOSIUM ON POLYMERIC ELECTRONICS PACKAGING - PROCEEDINGS, 1997, : 80 - 85
  • [3] Electrically conductive adhesives for electronic packaging and assembly applications
    Matienzo, L. J.
    Das, R. N.
    Egitto, F. D.
    [J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2008, 22 (8-9) : 853 - 869
  • [4] Formulation and Characterization of Electrically Conductive Adhesives for Electronic Packaging
    Cui, Hui-wang
    Fan, Qiong
    Li, Dong-sheng
    Tang, Xin
    [J]. JOURNAL OF ADHESION, 2013, 89 (01): : 19 - 36
  • [5] The effect of conductive filler on the properties of electrically conductive adhesives(ECAs)
    Hao, Jian
    Wang, Dapeng
    Li, Saipeng
    He, Xinyue
    Zhou, Jian
    Xue, Feng
    [J]. 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 803 - 808
  • [6] Electrical characterizations and considerations of electrically conductive adhesives (ECAs)
    Shimada, Y
    Lu, DQ
    Wong, CP
    [J]. INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 336 - 342
  • [7] Study on the Electrical Property of Silver (Ag) Nanoparticles Filled Epoxy Composites for the Application of Electrically Conductive Adhesives (ECAs) in Electronic Packaging
    Tee, D. I.
    Mariatti, M.
    See, C. H.
    Chong, K. F.
    [J]. IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 496 - +
  • [8] Jet printing morphology and rheological characteristics of silver paste electrically conductive adhesives (ECAs)
    Li, Saipeng
    Wang, Dapeng
    Zhou, Jian
    Xue, Feng
    He, Xinyue
    Zhou, Jian
    Xue, Feng
    [J]. 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 271 - 274
  • [9] Electrically Conductive Adhesives in Microelectronics Packaging
    Ayalasomayajula, Mukund
    Khurana, Mohit Ravi
    Chaudhary, Prince Shiva
    [J]. Journal of Electronic Packaging, 2024, 146 (04)
  • [10] An overview of the use of electrically conductive adhesives (ECAs) as a solder replacement
    Lewis, H. J.
    Coughlan, F. M.
    [J]. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2008, 22 (8-9) : 801 - 813
12345