Design Optimization of 16-nm Bulk FinFET Technology via Geometric Programming

被引:0
|
作者
Su, Ping-Hsun [1 ]
Li, Yiming [2 ]
机构
[1] Natl Chiao Tung Univ, Inst Commun Engn, Hsinchu 300, Taiwan
[2] Natl Chiao Tung Univ, Dept Elect & Comp Engn, Hsinchu 300, Taiwan
关键词
design rule; area; power; performance; variability; standard cell; optimization; geometry programming; bulk FinFET;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Design rule is an important interface between design and manufacturing. It becomes more complex as the process advances to 16-nm and beyond. Current approaches to generate design rules are empirical shrink and lithographic simulation. However, it is time-consuming and costly to revise design rules for performance boost and yield improvement after design rules are frozen. Early performance gains in early design rule development without cost increase and yield loss will benefit semiconductor industry. In this work, we for the first time consider 16-nm bulk FinFET standard cell performance, yield, area, and layout style simultaneously to optimize design rules to meet ITRS by using geometric programming. Optical proximity correction, and electromagnetic field and circuit simulations are performed for objective function evaluation. The result achieves more than 100%-delay and 50%-yield improvement without area change by this systematic and statistical approach.
引用
收藏
页数:4
相关论文
共 50 条
  • [41] An On-Chip Electromagnetic Bandgap Structure with ESD Protection for Noise Suppression in 16-nm FinFET CMOS
    Tsai, Ming-Hsien
    Hsu, Sen-Kuei
    Liu, Sally
    Hsueh, Fu-Lung
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2017, 27 (02) : 147 - 149
  • [42] Systematic Design Methodology for CMOS Millimeter-Wave Power Amplifiers With an E -Band Fully Differential Implementation in 16-nm FinFET
    Lauritano, Mario
    Baumgartner, Peter
    Singh, Puneet
    Ulusoy, Ahmet Cagri
    Guizan, Carla Moran
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2024, 72 (08) : 4650 - 4659
  • [43] Cryogenic Characterization of 16 nm FinFET Technology for Quantum Computing
    Han, Hung-Chi
    Jazaeri, Farzan
    D'Amico, Antonio
    Baschirotto, Andrea
    Charbon, Edoardo
    Enz, Christian
    IEEE 51ST EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2021), 2021, : 71 - 74
  • [44] Random Work Function Variation Induced Threshold Voltage Fluctuation in 16-nm Bulk FinFET Devices with High-κ-Metal-Gate Material
    Cheng, Hui-Wen
    Li, Yiming
    2010 14TH INTERNATIONAL WORKSHOP ON COMPUTATIONAL ELECTRONICS (IWCE 2010), 2010, : 331 - 334
  • [45] A Systematic Approach to Correlation Analysis of In-Line Process Parameters for Process Variation Effect on Electrical Characteristic of 16-nm HKMG Bulk FinFET Devices
    Su, Ping-Hsun
    Li, Yiming
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2016, 29 (03) : 209 - 216
  • [46] Cryogenic Characterization of 16 nm FinFET Technology for Quantum Computing
    Han, Hung-Chi
    Jazaeri, Farzan
    D'Amico, Antonio
    Baschirotto, Andrea
    Charbon, Edoardo
    Enz, Christian
    ESSCIRC 2021 - IEEE 47TH EUROPEAN SOLID STATE CIRCUITS CONFERENCE (ESSCIRC), 2021, : 71 - 74
  • [47] Electron induced SEU and MBU sensitivity of 20-nm planar and 16-nm FinFET SRAM-based FPGA
    Augustin, G.
    Mauguet, M.
    Andrianjohany, N.
    Sukhaseum, N.
    Chatry, N.
    Bezerra, F.
    2020 20TH EUROPEAN CONFERENCE ON RADIATION AND ITS EFFECTS ON COMPONENTS AND SYSTEMS (RADECS 2020), 2022, : 42 - 49
  • [48] A Device Design for 5 nm Logic FinFET Technology
    Ding, Yu
    Luo, Xin
    Shang, Enming
    Hu, Shaojian
    Chen, Shoumian
    Zhao, Yuhang
    2020 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2020 (CSTIC 2020), 2020,
  • [49] Design of UWB LNA in 45nm CMOS technology: Planar bulk vs. FinFET
    Ponton, D.
    Palestri, P.
    Esseni, D.
    Selmi, L.
    Tiebout, M.
    Parvais, B.
    Knoblinger, G.
    PROCEEDINGS OF 2008 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOLS 1-10, 2008, : 2701 - +
  • [50] Increased Device Variability Induced by Total Ionizing Dose in 16-nm Bulk nFinFETs
    Ma, Teng
    Bonaldo, Stefano
    Mattiazzo, Serena
    Baschirotto, Andrea
    Enz, Christian
    Paccagnella, Alessandro
    Gerardin, Simone
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2022, 69 (07) : 1437 - 1443