A global router for system-on-package targeting layer and crosstalk minimization

被引：3
|
作者：
Minz, JR [1 ]
Lim, SK [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2004年
关键词：
D O I：
10.1109/EPEP.2004.1407557
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, we formulate and solve a new 3D global routing problem for System-On-Package. Our divide-and-conquer algorithm provides an effective way to decompose the complex 3D problem into a set of 2D problems for simultaneous layer and crosstalk minimization.
引用
收藏
页码：99 / 102
页数：4
相关论文
共 50 条
  • [41] Substrate-Independent System-on-Package Antenna Integration with Inkjet Printing
    Tehrani, Bijan K.
    Tentzeris, Manos M.
    2016 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM, 2016, : 827 - 828
  • [42] Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications
    Windlass, H
    Raj, PM
    Balaraman, D
    Bhattacharya, SK
    Tummala, RR
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (01): : 10 - 16
  • [43] A system-on-package module by fully embedding chip components in organic substrate
    System Package Research Center, Korea Electronics Technology Institute, #68 Yatap-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, 463-816, Korea, Republic of
    不详
    Eur. Microw. Week: Connecting World, EuMIC - Conf. Proc., 1600, (313-316):
  • [44] Crosstalk minimization in two-layer channel routing
    Pal, A
    Singha, A
    Ghosh, S
    Pal, RK
    2002 IEEE REGION 10 CONFERENCE ON COMPUTERS, COMMUNICATIONS, CONTROL AND POWER ENGINEERING, VOLS I-III, PROCEEDINGS, 2002, : 408 - 411
  • [45] Analysis of lossy packaging parasitics for common emitter LNA in system-on-package
    Duo, XZ
    Zheng, LR
    Ismail, M
    Tenhunen, H
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2004, : 75 - 78
  • [46] Design and implementation of system-on-package for radio and mixed-signal applications
    Zheng, LR
    Duo, XZ
    Shen, MG
    Torrika, T
    Michielsen, W
    Tenhunen, H
    Chen, L
    Zou, G
    Liu, JH
    PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, : 97 - 104
  • [47] Gain-Enhanced LTCC System-on-Package for Automotive UMRR Applications
    Ghaffar, F. A.
    Khalid, M. U.
    Shamim, A.
    Salama, K. N.
    53RD IEEE INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS, 2010, : 934 - 937
  • [48] Fine line photolithography and ultra high density package substrate for next generation system-on-package (SOP)
    Liu, Fuhan
    Sundaram, Venky
    Wiedenman, Boyd
    Tummala, Rao
    ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, : 109 - 113
  • [49] Crosstalk minimization method for system-on-chip
    Kao, Chi-Chou
    2007 INTERNATIONAL CONFERENCE ON COMMUNICATIONS, CIRCUITS AND SYSTEMS PROCEEDINGS, VOLS 1 AND 2: VOL 1: COMMUNICATION THEORY AND SYSTEMS; VOL 2: SIGNAL PROCESSING, COMPUTATIONAL INTELLIGENCE, CIRCUITS AND SYSTEMS, 2007, : 1181 - 1184
  • [50] GLADE: A Modern Global Router Considering Layer Directives
    Chang, Yen-Jung
    Lee, Tsung-Hsien
    Wang, Ting-Chi
    2010 IEEE AND ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2010, : 319 - 323
12345