A global router for system-on-package targeting layer and crosstalk minimization

被引：3
|
作者：
Minz, JR [1 ]
Lim, SK [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2004年
关键词：
D O I：
10.1109/EPEP.2004.1407557
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, we formulate and solve a new 3D global routing problem for System-On-Package. Our divide-and-conquer algorithm provides an effective way to decompose the complex 3D problem into a set of 2D problems for simultaneous layer and crosstalk minimization.
引用
收藏
页码：99 / 102
页数：4
相关论文
共 50 条
  • [21] System-on-package (SOP) : Next generation convergent microminiaturized microsystems package solution
    Gacusan, RL
    2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2002, 4931 : 188 - 193
  • [22] A system-on-package integration of 60 GHz ASK transmitter
    Jung, DY
    Chang, WI
    Park, CS
    2006 IEEE RADIO AND WIRELESS SYMPOSIUM, PROCEEDINGS, 2006, : 151 - 154
  • [23] Optical routing for 3-D system-on-package
    Rajkurnar, Jacob
    Thyagara, Sornaskanda
    Lim, Sung Kyu
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (04): : 805 - 812
  • [24] Power distribution networks for system-on-package: Status and challenges
    Swaminathan, M
    Kim, J
    Novak, I
    Libous, JP
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (02): : 286 - 300
  • [25] Multi-layer Coupled Band-pass Filter for 60 GHz LTCC System-on-Package
    Hiraga, Ken
    Seki, Tomohiro
    Nishikawa, Kenjiro
    Uehara, Kazuhiro
    2010 ASIA-PACIFIC MICROWAVE CONFERENCE, 2010, : 259 - 262
  • [26] FastRoute 4.0: Global Router with Efficient Via Minimization
    Xu, Yue
    Zhang, Yanheng
    Chu, Chris
    PROCEEDINGS OF THE ASP-DAC 2009: ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE 2009, 2009, : 576 - 581
  • [27] System-on-package: a broad perspective from system design to technology development
    Zheng, LR
    Liu, JH
    MICROELECTRONICS RELIABILITY, 2003, 43 (08) : 1339 - 1348
  • [28] Layer assignment algorithm for RLC crosstalk minimization
    Liu, B
    Cai, YC
    Zhou, Q
    Hong, XL
    2004 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS, VOL 5, PROCEEDINGS, 2004, : 85 - 88
  • [29] Design and development of optoelectronic mixed signal system-on-package (SOP)
    Iyer, MK
    Ramana, PAV
    Sudharsanam, K
    Leo, CJ
    Sivakumar, M
    Pong, BLS
    Ling, X
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2004, 27 (02): : 278 - 285
  • [30] Selection and evaluation of materials for future System-on-Package (SOP) substrate
    Raj, PM
    Shinotani, K
    Seo, M
    Bhattacharya, S
    Sundaram, V
    Zama, S
    Lu, JC
    Zweben, C
    White, GE
    Tummala, RR
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1193 - 1197
12345