A global router for system-on-package targeting layer and crosstalk minimization

被引：3
|
作者：
Minz, JR [1 ]
Lim, SK [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2004年
关键词：
D O I：
10.1109/EPEP.2004.1407557
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, we formulate and solve a new 3D global routing problem for System-On-Package. Our divide-and-conquer algorithm provides an effective way to decompose the complex 3D problem into a set of 2D problems for simultaneous layer and crosstalk minimization.
引用
收藏
页码：99 / 102
页数：4
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