Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM

被引：4

作者：

Uemura, Taiki ^{[1
]}

Chung, Byungjin ^{[1
]}

Jo, Jeongmin ^{[1
]}

Jiang, Hai ^{[1
]}

Ji, Yongsung ^{[1
]}

Jeong, Tae-Young ^{[1
]}

Ranjan, Rakesh ^{[1
]}

Lee, Seungbae ^{[1
]}

Rhee, Hwasung ^{[1
]}

Pae, Sangwoo ^{[1
]}

Lee, Euncheol ^{[1
]}

Choi, Jaehee ^{[2
]}

Ohnishi, Shota ^{[3
]}

Machida, Ken ^{[3
]}

机构：

[1] Samsung Elect Co Ltd, Samsung Foundry, Suwon, South Korea

[2] Samsung Elect Co Ltd, Semicond Res & Dev Ctr, Suwon, South Korea

[3] Samsung R&D Inst Japan, Yokohama, Kanagawa, Japan

来源：

2020 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | 2020年

关键词：

soft error; 7 nm FinFET; SRAM; SER; SEU;

D O I：

10.1109/irps45951.2020.9129331

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper proposes an alternative method of alpha-irradiation test in flip-chip packages, backside irradiation test in EUV 7nm FinFET SRAM. The backside-test is conducted in backside-ground flip-chips. The sample thickness is measured, and the correlation factor is calculated by Monte-Carlo simulations. The results of backside- and front-side-tests show the dependability of the proposed method.

引用

页数：4

共 26 条

[1] An alternative approach to measure alpha-particle-induced SEU cross-section for flip-chip packaged SRAM devices: High energy alpha backside irradiation
Khan, Saqib Ali
Lim, Chulseung
Bak, Geunyong
Baeg, Sanghyeon
Lee, Soonyoung
MICROELECTRONICS RELIABILITY, 2017, 69 : 100 - 108
[2] Flip-Chip Chip Scale Package (FCCSP) Process Characterization and Reliability of Coreless Thin Package with 7nm Si Technology
De Mesa, Eduardo
Wagner, Thomas
Keser, Beth
Proschwitz, Jan
Waidhas, Bernd
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 266 - 270
[3] Assessing alpha-particle-induced SEU sensitivity of flip-chip bonded SRAM using high energy irradiation
Khan, Saqib A.
Wen, Shi-Jie
Baeg, Sanghyeong
IEICE ELECTRONICS EXPRESS, 2016, 13 (17):
[4] New applications of the Infrared Emission Microscopy to wafer-level backside and flip-chip package analyses
Hsiung, S
Tan, K
Luo, J
2002 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP - FINAL REPORT, 2002, : 147 - 150
[5] Advanced Flip-Chip Package Solution for 28nm Si Node and Beyond
Liu, C. S.
Chen, C. S.
Lee, C. H.
Tsai, H. Y.
Pu, H. P.
Cheng, M. D.
Kuo, T. H.
Chen, H. W.
Wu, C. Y.
Lii, M. J.
Yu, Doug C. H.
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 436 - 438
[6] Evaluation of molded flip-chip BGA package for 28nm FPGA applications
Sure, Ganesh
Lee, M.J.
Lau, Sam
Galloway, Jesse
Darveaux, Robert
Jimarez, Miguel
Kanuparthi, Sasanka
Reichman, Corey
Kim, Jae Yun
Kim, Joon Dong
SMT Surface Mount Technology Magazine, 2013, 28 (08): : 24 - 40
[7] A 7nm FinFET SRAM Macro Using EUV Lithography for Peripheral Repair Analysis
Song, Taejoong
Kim, Hoonki
Rim, Woojin
Kim, Yongho
Park, Sunghyun
Park, Changnam
Hong, Minsun
Yang, Giyong
Do, Jeongho
Lim, Jinyoung
Lee, Seungyoung
Kim, Ingyum
Baek, Sanghoon
Jung, Jonghoon
Ha, Daewon
Jang, Hyungsoon
Lee, Taejung
Park, Chul-Hong
Kwon, Bongjae
Jung, Hyuntaek
Cho, Sungwee
Choo, Yongjae
Choi, JaeSeung
2017 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC), 2017, : 208 - 208
[8] Advanced Flip-Chip Package Production Solution for 40nm/28nm Technology Nodes
Chen, C. S.
Liu, C. S.
Lee, C. H.
Tsai, H. Y.
Pu, H. P.
Hsu, K. C.
Kuo, H. J.
Cheng, M. D.
Wu, C. Y.
Chiu, S. L.
Wu, K. C.
Chen, H. W.
Hsiao, C. W.
Tung, C. H.
Lii, M. J.
Yu, Douglas C. H.
2010 INTERNATIONAL ELECTRON DEVICES MEETING - TECHNICAL DIGEST, 2010,
[9] Finite Element Modeling Methodology for Monotonic Bend Test of Flip-Chip BGA Package
McCann, Scott
Lee, Tom
Ramalingam, Suresh
2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 2086 - 2091
[10] Soft-Error Susceptibility in Flip-Flop in EUV 7 nm Bulk-FinFET Technology
Uemura, Taiki
Chung, Byungjin
Jo, Jeongmin
Kim, Mijoung
Lee, Dalhee
Kim, Gunrae
Lee, Seungbae
Song, Taesjoong
Rhee, Hwasung
Lee, Brandon
Choi, Jaehee
2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2021,

← 1 2 3 →