Decapsulation of IC Package by Atmospheric Microwave Plasma Needle

被引：0

作者：

Kral, Martin ^{[1
,2
]}

Kando, Masashi ^{[2
]}

Blajan, Marius Gabriel ^{[2
]}

Tsujita, Yoichi ^{[1
]}

Suzuki, Satoshi ^{[1
]}

Yamaichi, Yasutoshi ^{[1
]}

机构：

[1] Nippon Sci Co Ltd, Tokyo, Japan

[2] Plasma Applicat Co Ltd, Hamamatsu, Shizuoka, Japan

来源：

ISTFA 2016: CONFERENCE PROCEEDINGS FROM THE 42ND INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS | 2016年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We present experimental results of IC package decapsulation carried out using Ar and O-2 gas mixture remote plasma generated by atmospheric microwave plasma needle ("a-MPN"). Depth etch rate of up to 6.5 mu m/min and volume etch rate of up to 0.1 mm(3)/min were shown to be obtained by a-MPN process operated at 15 W microwave power. SEM imaging suggested no damage to the bonding wire, pads, or passivation.

引用

页码：193 / 196

页数：4

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