Decapsulation of IC Package by Atmospheric Microwave Plasma Needle

被引：0

作者：

Kral, Martin ^{[1
,2
]}

Kando, Masashi ^{[2
]}

Blajan, Marius Gabriel ^{[2
]}

Tsujita, Yoichi ^{[1
]}

Suzuki, Satoshi ^{[1
]}

Yamaichi, Yasutoshi ^{[1
]}

机构：

[1] Nippon Sci Co Ltd, Tokyo, Japan

[2] Plasma Applicat Co Ltd, Hamamatsu, Shizuoka, Japan

来源：

ISTFA 2016: CONFERENCE PROCEEDINGS FROM THE 42ND INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS | 2016年

关键词：

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

We present experimental results of IC package decapsulation carried out using Ar and O-2 gas mixture remote plasma generated by atmospheric microwave plasma needle ("a-MPN"). Depth etch rate of up to 6.5 mu m/min and volume etch rate of up to 0.1 mm(3)/min were shown to be obtained by a-MPN process operated at 15 W microwave power. SEM imaging suggested no damage to the bonding wire, pads, or passivation.

引用

页码：193 / 196

页数：4

共 50 条

[11] Microwave atmospheric plasma
不详
JOURNAL OF THERMAL SPRAY TECHNOLOGY, 2004, 13 (04) : 491 - 491
[12] Acid Decapsulation for silver wire bonded package
Suzuki, Satoshi
Yamaguchi, Mamiko
PROCEEDINGS OF THE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA 2015), 2015, : 492 - 495
[13] Decapsulation Techniques for Cu Wire Bonding Package
Meng, Dongmei
Rupley, Joe
McMahon, Chris
ISTFA 2009, 2009, : 217 - 221
[14] Acid Decapsulation for silver wire bonded package
Suzuki, Satoshi
Yamaguchi, Mamiko
ISTFA 2015: CONFERENCE PROCEEDINGS FROM THE 41ST INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2015, : 436 - 440
[15] Flexible System for Real-time Plasma Decapsulation of Copper Wire Bonded IC Packagesa
Tang, J.
Schelen, J. B. J.
Beenakker, C. I. M.
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 1764 - 1769
[16] The IC package
Optimal Corp., 6980 Santa Teresa Blvd., San Jose, CA 95119-1346
不详
Adv Packag, 2006, 2 (16-18):
[17] CF4-free Microwave Induced Plasma Decapsulation of Automotive Semiconductor Devices
Tang, Jiaqi
Wang, Jing
Anderson, Gregory B.
Bruckmeier, Johannes
Keller, Claudia
Dela Cruz, Genny V.
Beenakker, Kees
ISTFA 2016: CONFERENCE PROCEEDINGS FROM THE 42ND INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 2016, : 151 - 160
[18] Generation of needle injection plasma at atmospheric pressure
Shin, Dong H.
Hong, Yong Cheol
Uhm, Han Sup
IEEE TRANSACTIONS ON PLASMA SCIENCE, 2006, 34 (05) : 2464 - 2465
[19] Microwave atmospheric plasma technology is deployed
不详
MICROWAVE JOURNAL, 2004, 47 (07) : 53 - 53
[20] Atmospheric pressure nitrogen microwave plasma
Lestinska, Lenka
Foltin, Viktor
Machala, Zdenko
IEEE TRANSACTIONS ON PLASMA SCIENCE, 2008, 36 (04) : 962 - 963

← 1 2 3 4 5 →