Effect of gate length on breakdown voltage in AlGaN/GaN high-electron-mobility transistor

被引:15
|
作者
Luo, Jun [1 ]
Zhao, Sheng-Lei [1 ]
Mi, Min-Han [1 ]
Chen, Wei-Wei [2 ]
Hou, Bin [2 ]
Zhang, Jin-Cheng [1 ]
Ma, Xiao-Hua [1 ,2 ]
Hao, Yue [1 ]
机构
[1] Xidian Univ, Sch Microelect, Key Lab Wide Band Gap Semicond Mat & Devices, Xian 710071, Peoples R China
[2] Xidian Univ, Sch Adv Mat & Nanotechnol, Xian 710071, Peoples R China
基金
中国国家自然科学基金;
关键词
AlGaN/GaN high-electron-mobility transistors (HEMTs); breakdown voltage; gate length; GANHEMTS; HEMTS;
D O I
10.1088/1674-1056/25/2/027303
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
The effects of gate length L-G on breakdown voltage V-BR are investigated in AlGaN/GaN high-electron-mobility transistors (HEMTs) with LG = 1 mu m similar to 20 mu m. With the increase of L-G, V-BR is first increased, and then saturated at L-G = 3 mu m. For the HEMT with L-G = 1 mu m, breakdown voltage V-BR is 117 V, and it can be enhanced to 148 V for the HEMT with L-G = 3 mu m. The gate length of 3 mu m can alleviate the buffer-leakage-induced impact ionization compared with the gate length of 1 mu m, and the suppression of the impact ionization is the reason for improving the breakdown voltage. A similar suppression of the impact ionization exists in the HEMTs with L-G > 3 mu m. As a result, there is no obvious difference in breakdown voltage among the HEMTs with L-G = 3 mu m similar to 20 mu m, and their breakdown voltages are in a range of 140 V-156 V.
引用
收藏
页数:5
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