Strain localization band width evolution by electronic speckle pattern interferometry strain rate measurement

被引:9
|
作者
Guelorget, Bruno [1 ]
Francois, Manuel [1 ]
Montay, Guillaume [1 ]
机构
[1] Univ Technol Troyes, FRE CNRS 2848, LASMIS, Inst Charles Delaunay, F-10010 Troyes Cedex, France
关键词
Shear bands; Tension test; Copper; Electronic speckle pattern interferometry (ESPI); Localization; DIGITAL IMAGE CORRELATION; UNIAXIAL TENSILE TESTS; BULGE TEST;
D O I
10.1016/j.scriptamat.2008.12.036
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
In this paper, electronic speckle pattern interferometry strain rate measurements are used to quantify the width of the strain localization band, which occurs when a sheet specimen is submitted to tension. It is shown that the width of this band decreases with increasing strain. Just before fracture, this measured width is about five times wider than the shear band and the initial sheet thickness. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:647 / 650
页数:4
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