Strain localization band width evolution by electronic speckle pattern interferometry strain rate measurement

被引：9
|
作者：
Guelorget, Bruno [1 ]
Francois, Manuel [1 ]
Montay, Guillaume [1 ]
机构：
[1] Univ Technol Troyes, FRE CNRS 2848, LASMIS, Inst Charles Delaunay, F-10010 Troyes Cedex, France
来源：
SCRIPTA MATERIALIA | 2009年 / 60卷 / 08期
关键词：
Shear bands; Tension test; Copper; Electronic speckle pattern interferometry (ESPI); Localization; DIGITAL IMAGE CORRELATION; UNIAXIAL TENSILE TESTS; BULGE TEST;
D O I：
10.1016/j.scriptamat.2008.12.036
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
In this paper, electronic speckle pattern interferometry strain rate measurements are used to quantify the width of the strain localization band, which occurs when a sheet specimen is submitted to tension. It is shown that the width of this band decreases with increasing strain. Just before fracture, this measured width is about five times wider than the shear band and the initial sheet thickness. (C) 2009 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码：647 / 650
页数：4
相关论文
共 50 条
  • [21] Monitoring the strain-rate progression of an aluminium sample undergoing tensile deformation by electronic speckle-pattern interferometry (ESPI)
    Cordero, RR
    Labbé, F
    JOURNAL OF PHYSICS D-APPLIED PHYSICS, 2006, 39 (11) : 2419 - 2426
  • [22] Notch root strain measurement of WE43-T6 magnesium alloy using electronic speckle pattern interferometry
    Liew, H. L.
    Ahmad, A.
    Ramesh, S.
    Purbolaksono, J.
    MATERIALS & DESIGN, 2013, 51 : 206 - 211
  • [23] Whole-field strain measurement in a pin-loaded plate by electronic speckle pattern interferometry and the finite element method
    F. Lanza di Scalea
    S. S. Hong
    G. L. Cloud
    Experimental Mechanics, 1998, 38 : 55 - 60
  • [24] Study on Displacement Measurement for Induced Strain Field Based on Digital Speckle Pattern Interferometry Method
    Liu Jing
    Zhang Hui
    Li Jun
    Chen Dachuan
    Tang Yankun
    2011 IEEE 12TH INTERNATIONAL CONFERENCE ON COMPUTER-AIDED INDUSTRIAL DESIGN & CONCEPTUAL DESIGN, VOLS 1 AND 2: NEW ENGINES FOR INDUSTRIAL DESIGN: INTELLIGENCE - INTERACTION - SERVICES, 2011, : 488 - 491
  • [25] Whole-field strain measurement in a pin-loaded plate by electronic speckle pattern interferometry and the finite element method
    di Scalea, FL
    Hong, SS
    Cloud, GL
    EXPERIMENTAL MECHANICS, 1998, 38 (01) : 55 - 60
  • [26] Measurement of strain distributions in mouse femora with 3D-digital speckle pattern interferometry
    Yanga, Lianxiang
    Zhang, Ping
    Liu, Sheng
    Samala, Praveen R.
    Su, Min
    Yokota, Hiroki
    OPTICS AND LASERS IN ENGINEERING, 2007, 45 (08) : 843 - 851
  • [27] ELECTRONIC SPECKLE PATTERN INTERFEROMETRY
    LOKBERG, O
    PHYSICS IN TECHNOLOGY, 1980, 11 (01): : 16 - 22
  • [28] Shape measurement by carrier modulation in electronic speckle pattern interferometry
    SUN Ping
    Optoelectronics Letters, 2008, (03) : 223 - 226
  • [29] Multiwavelength electronic speckle pattern interferometry for surface shape measurement
    Barbosa, Eduardo A.
    Lino, Antonio C. L.
    APPLIED OPTICS, 2007, 46 (14) : 2624 - 2631
  • [30] Shape measurement by carrier modulation in electronic speckle pattern interferometry
    College of Physics and Electronics, Shandong Normal University, Jinan 250014, China
    Guangdianzi Jiguang, 2008, 4 (525-527): : 525 - 527
12345