ELECTRONIC SPECKLE PATTERN INTERFEROMETRY MEASUREMENT OF RESIDUAL STRESS

被引:0
|
作者
Sedivy, Otomar [1 ]
Krempaszky, Christian
Holy, Stanislav [1 ]
机构
[1] Czech Tech Univ, Fac Mech Engn, Dept Mech Biomech & Mechatron, Prague 16607 6, Czech Republic
关键词
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
引用
收藏
页码:229 / 230
页数:2
相关论文
共 50 条
  • [1] Measurement of residual stress using fibre electronic speckle pattern interferometry
    Zhang, JB
    Fok, WC
    Chong, TC
    [J]. INTERNATIONAL CONFERENCE ON EXPERIMENTAL MECHANICS: ADVANCES AND APPLICATIONS, 1997, 2921 : 584 - 591
  • [2] Residual Stress Measurement of Flat Welded Specimen by Electronic Speckle Pattern Interferometry
    Chang, Ho-Seob
    Kim, Dong-Soo
    Jung, Hyun-Chul
    Kim, Kyung-Suk
    [J]. JOURNAL OF THE KOREAN SOCIETY FOR NONDESTRUCTIVE TESTING, 2012, 32 (02) : 149 - 154
  • [3] RESIDUAL STRESS MEASUREMENT BY ELECTRONIC SPECKLE PATTERN INTERFEROMETRY: A STUDY OF THE INFLUENCE OF ANALYSIS PARAMETERS
    Barile, Claudia
    Casavola, Caterina
    Pappalettera, Giovanni
    Pappalettere, Carmine
    [J]. STRUCTURAL INTEGRITY AND LIFE-INTEGRITET I VEK KONSTRUKCIJA, 2012, 12 (03): : 159 - 163
  • [4] RESIDUAL STRESS MEASUREMENT ON THE BUTT-WELDED AREA BY ELECTRONIC SPECKLE PATTERN INTERFEROMETRY
    Kim, Kyeongsuk
    Choi, Taeho
    Na, Man Gyun
    Jung, Hyunchul
    [J]. NUCLEAR ENGINEERING AND TECHNOLOGY, 2015, 47 (01) : 115 - 125
  • [5] Remarks on Residual Stress Measurement by Hole-Drilling and Electronic Speckle Pattern Interferometry
    Barile, Claudia
    Casavola, Caterina
    Pappalettera, Giovanni
    Pappalettere, Carmine
    [J]. SCIENTIFIC WORLD JOURNAL, 2014,
  • [6] RESIDUAL STRESS MEASUREMENT BY ELECTRONIC SPECKLE PATTERN INTERFEROMETRY: A STUDY OF THE INFLUENCE OF GEOMETRICAL PARAMETERS
    Barile, Claudia
    Casavola, Caterina
    Pappalettera, Giovanni
    Pappalettere, Carmine
    [J]. STRUCTURAL INTEGRITY AND LIFE-INTEGRITET I VEK KONSTRUKCIJA, 2011, 11 (03): : 177 - 182
  • [7] Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method
    Sim, CN
    Tay, CJ
    Cheng, L
    [J]. Third International Conference on Experimental Mechanics and Third Conference of the Asian-Committee-on-Experimental-Mechanics, Pts 1and 2, 2005, 5852 : 938 - 944
  • [8] Residual stress determination and defect detection using electronic speckle pattern interferometry
    Gryzagoridis, J
    Findeis, D
    Tait, RB
    [J]. INSIGHT, 2005, 47 (02) : 91 - 94
  • [9] Fiber electronic speckle pattern interferometry and its applications in residual stress measurements
    Zhang, JB
    Chong, TC
    [J]. APPLIED OPTICS, 1998, 37 (28): : 6707 - 6715
  • [10] Residual stress measurement by laser annealing and speckle interferometry
    Millerd, JE
    Trolinger, JD
    Vikram, CS
    Pechersky, MJ
    [J]. NONDESTRUCTIVE EVALUATION OF AGING AIRCRAFT, AIRPORTS, AND AEROSPACE HARDWARE, 1996, 2945 : 78 - 86