Tier-Independent Microfluidic Cooling for Heterogeneous 3D ICs with Nonuniform Power Dissipation

被引：0
|
作者：
Zhang, Yue [1 ]
Zheng, Li [1 ]
Bakir, Muhannad S. [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
来源：
PROCEEDINGS OF THE 2013 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC) | 2013年
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中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Embedded microfluidic cooling is considered a promising solution for heat removal in 3D ICs. This paper presents tier-independent microfluidic cooling in a 2-tier chip thermal testbed. Each tier has 4 segmented heaters emulating a simplified multicore processor. Tier-independent cooling is shown to reduce the pumping power by 37.5% by preventing over-cooling when an operating temperature is specified. Thermal coupling for 3D chips with liquid cooling is also discussed.
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页数：3
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