3D Stacked Microfluidic Cooling for High-Performance 3D ICs

被引：0
|
作者：
Zhang, Yue [1 ]
Dembla, Ashish [1 ]
Joshi, Yogendra [2 ]
Bakir, Muhannad S. [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Eng, Atlanta, GA 30332 USA
[2] Georgia Inst Technol, Sch Mech Engn, POB 4010, Atlanta, GA 30332 USA
来源：
2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2012年
关键词：
High performance 3D IC; on-demand interlayer cooling; single phase cooling; 3D IC centric heat sink design; MICRO-PIN-FINS; HEAT-TRANSFER; TECHNOLOGY; FLOW; PACKAGES; CHIPS; SINK;
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Cooling is a significant challenge for high-performance high-power 3D ICs. In this paper, we describe the experimental evaluation of 3D ICs with embedded microfluidic cooling. Different architectures are experimentally evaluated including: 1) a memory-on-processor stack, 2) a processor-on-processor stack with equal power dissipation, and 3) a processor-on-processor stack with different power dissipation. In all cases, embedded microfluidic cooling shows significant junction temperature reduction compared to air-cooling.
引用
收藏
页码：1644 / 1650
页数：7
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