3-D Stacked Tier-Specific Microfluidic Cooling for Heterogeneous 3-D ICs

被引:20
|
作者
Zhang, Yue [1 ]
Zheng, Li [1 ]
Bakir, Muhannad S. [1 ]
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
关键词
3-D IC; leakage power; microchannel heat sink; micropin-fin (MPF) heat sink; multicore processors; HEAT-TRANSFER; TECHNOLOGY; CHIPS;
D O I
10.1109/TCPMT.2013.2281605
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Cooling is a significant challenge for high-performance and high-power 3-D ICs. In this paper, tier-specific microfluidic cooling technology is proposed and experimentally evaluated in a 3-D stack. Different stacking scenarios are experimentally evaluated including: 1) a memory-on-processor stack; 2) a processor-on-processor stack with equal power dissipation; 3) a processor-on-processor stack with different power dissipations; and 4) a two-tier 3-D stack with each tier containing four cores along the flow direction. Compared with conventional microfluidic cooling, the tier-specific cooling is shown to reduce the pumping power by 37.5% by preventing overcooling when an operating temperature is specified. The results are benchmarked with an air-cooled heat sink. The impact of the lateral thermal gradient along the flow direction on the electrical performances, including leakage power and clock frequency, is analyzed.
引用
收藏
页码:1811 / 1819
页数:9
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