Monolithic 3D III-V HEMT for future communication and quantum computing

被引：0
|
作者：
Kim, Sanghyeon [1 ]
机构：
[1] Korea Adv Inst Sci & Technol KAIST, Seoul, South Korea
来源：
2022 INTERNATIONAL CONFERENCE ON IC DESIGN AND TECHNOLOGY (ICICDT) | 2022年
关键词：
D O I：
10.1109/ICICDT56182.2022.9933095
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
Recently, monolithic 3-dimensional (M3D) integration has stirred much attention in various applications such as CMOS, RF, image sensors, etc. In terms of the materials, III-V could be promising candidates due to their superior material characteristics and low process temperature, which are important constrain in M3D integration. In this talk, we discuss one of the potential applications of III-V-based M3D including communication and quantum computing.
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收藏
页码：XXVI / XXVI
页数：1
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