Aspect ratio engineering of microlens arrays in thin-film flip-chip light-emitting diodes

被引:13
|
作者
Zhu, Peifen [1 ,2 ]
Tan, Chee-Keong [1 ]
Sun, Wei [1 ]
Tansu, Nelson [1 ]
机构
[1] Lehigh Univ, Dept Elect & Comp Engn, Ctr Photon & Nanoelect, Bethlehem, PA 18015 USA
[2] Univ Tulsa, Dept Phys & Engn Phys, Tulsa, OK 74104 USA
基金
美国国家科学基金会;
关键词
EXTRACTION EFFICIENCY ENHANCEMENT; INTERNAL QUANTUM EFFICIENCY; MICROSPHERE ARRAYS; WELLS; FABRICATION; IMPACT;
D O I
10.1364/AO.54.010299
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
Light extraction efficiency of thin-film flip-chip InGaN-based light-emitting diodes (LEDs) with a TiO2 microlens arrays was calculated by employing the finite-difference time-domain method. The microlens arrays, formed by embedding hexagonal close-packed TiO2 sphere arrays in a polystyrene (PS) layer, were placed on top of the InGaN LED to serve as an intermediate medium for light extraction. By tuning the thickness of the PS layer, in-coupling and out-coupling efficiencies were optimized to achieve maximum light extraction efficiency. A thicker PS layer resulted in higher in-coupling efficiency, while a thinner PS layer led to higher out-coupling efficiency. Thus, the maximum light extraction efficiency becomes a trade-off between in-coupling and out-coupling efficiency. In addition, the cavity formed by the PS layer also affects light extraction from the LED. Our study reveals that a maximum light extraction efficiency of 86% was achievable by tuning PS thickness to 75 nm with maximized in-coupling and out-coupling efficiency accompanied by the optimized resonant cavity condition. (C) 2015 Optical Society of America
引用
收藏
页码:10299 / 10303
页数:5
相关论文
共 50 条
  • [41] Investigation of high extraction efficiency flip-chip GaN-based light-emitting diodes
    XiaoLi Da
    GuangDi Shen
    Chen Xu
    DeShu Zou
    YanXu Zhu
    Jia Zhang
    [J]. Science in China Series F: Information Sciences, 2009, 52 : 1476 - 1482
  • [42] Optical, spectral, and thermal characteristics of InGaN/GaN green flip-chip light-emitting diodes
    Lee, Soo Hyun
    Kim, Dong Churl
    Kim, Jongbae
    Jeon, Soo-Kun
    Yu, Jae Su
    [J]. SOLID-STATE ELECTRONICS, 2015, 104 : 20 - 24
  • [43] Visible Flip-Chip Light-Emitting Diodes on Flexible Ceramic Substrate With Improved Thermal Management
    Kim, Seung Hwan
    Singh, Shivkant
    Oh, Seung Kyu
    Lee, Dong Kyu
    Lee, Keon Hwa
    Shervin, Shahab
    Asadirad, Mojtaba
    Venkateswaran, Venkat
    Olenick, Kathy
    Olenick, John A.
    Lee, Sung-Nam
    Kwak, Joon Seop
    Mavrokefalos, Anastassios
    Ryou, Jae-Hyun
    [J]. IEEE ELECTRON DEVICE LETTERS, 2016, 37 (05) : 615 - 617
  • [44] Nanorod-structured flip-chip GaN-based white light-emitting diodes
    Lee, Ching-Ting
    Su, Yu-Ting
    Lee, Hsin-Ying
    [J]. LIGHT-EMITTING DIODES: MATERIALS, DEVICES, AND APPLICATIONS FOR SOLID STATE LIGHTING XVIII, 2014, 9003
  • [45] Thermal simulation and analysis of flat surface flip-chip high power light-emitting diodes
    陈茂兴
    徐晨
    许坤
    郑雷
    [J]. Journal of Semiconductors, 2013, 34 (12) - 56
  • [46] Flip-chip GaN-based light-emitting diodes with mesh-contact electrodes
    Zhu Yan-Xu
    Chen, Xu
    Jun, Han
    Shen Guang-Di
    [J]. CHINESE PHYSICS LETTERS, 2007, 24 (01) : 268 - 270
  • [47] Characteristics of flip-chip InGaN-based light-emitting diodes on patterned sapphire substrates
    Wang, Wei-Kai
    Wuu, Dong-Sing
    Lin, Shu-Hei
    Huang, Shih-Yung
    Han, Pin
    Horng, Ray-Hua
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (4B): : 3430 - 3432
  • [48] Investigation on Solder Voids in Flip-Chip Light-Emitting Diodes Using Thermal Transient Response
    Ma, Byungjin
    Kim, Chang Wan
    Lee, Kun Hyung
    Suh, Won-Bae
    Lee, Kwanhun
    [J]. 2016 22ND INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2016, : 272 - 275
  • [49] Directional Polarized Light Emission from Thin-Film Light-Emitting Diodes
    Fu, Xiangyu
    Mehta, Yash
    Chen, Yi-An
    Lei, Lei
    Zhu, Liping
    Barange, Nilesh
    Dong, Qi
    Yin, Shichen
    Mendes, Juliana
    He, Siliang
    Gogusetti, Renuka
    Chang, Chih-Hao
    So, Franky
    [J]. ADVANCED MATERIALS, 2021, 33 (09)
  • [50] Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
    Shang, Andrew W.
    Lo, Jeffery C. C.
    Lee, Ricky S. W.
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 9 (03): : 562 - 566