Optical, spectral, and thermal characteristics of InGaN/GaN green flip-chip light-emitting diodes

被引:7
|
作者
Lee, Soo Hyun [1 ]
Kim, Dong Churl [2 ]
Kim, Jongbae [2 ]
Jeon, Soo-Kun [3 ]
Yu, Jae Su [1 ]
机构
[1] Kyung Hee Univ, Dept Elect & Radio Engn, Yongin 446701, Gyeonggi Do, South Korea
[2] Elect & Telecommun Res Inst, Taejon 305700, South Korea
[3] Semicon Light Co Ltd, Yongin 446701, Gyeonggi Do, South Korea
关键词
InGaN/GaN green light-emitting diodes; Flip-chip structure; Junction temperature; Forward voltage method; Finite element method; EXTRACTION EFFICIENCY; ENHANCEMENT; PERFORMANCE; LEDS; BLUE;
D O I
10.1016/j.sse.2014.11.003
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We reported the temperature-dependent device characteristics of InGaN/GaN green flip-chip light-emitting diodes (large chip size of 1125 x 1125 mu m(2)) on patterned sapphire substrate. Through the experiments in the temperature range of 298-358 K, optical, electrical, and spectral properties were measured and analyzed. At 350 mA and 298 K, the optical output power of 56.2 mW, forward voltage of 3.26 V, and emission peak wavelength of 503.6 nm were obtained. The characteristic temperature was also estimated at an injection current of 350 mA under pulsed mode, indicating a value of 1019 K. The junction temperature was experimentally measured by the forward voltage method. For comparison with theoretically calculated results, three-dimensional steady-state heat transfer model based on finite element method was employed. The thermal resistance (similar to 12.76 K/W) extracted from the experimental results exhibited a similar value with the simulated result (similar to 14.22 K/W). (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:20 / 24
页数:5
相关论文
共 50 条
  • [1] Optical, spectral, and thermal analyses of InGaN/GaN near-ultraviolet flip-chip light-emitting diodes with different package structures
    Lee, Soo Hyun
    Guan, Xiang-Yu
    Yu, Jae Su
    [J]. PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2017, 214 (05):
  • [2] High power and high reliability GaN/InGaN flip-chip light-emitting diodes
    Zhang Jian-Ming
    Zou De-Shu
    Xu Chen
    Zhu Yan-Xu
    Liang Ting
    Da Xiao-Li
    Shen Guang-Di
    [J]. CHINESE PHYSICS, 2007, 16 (04): : 1135 - 1139
  • [3] Optical cavity effects in InGaN/GaN quantum-well-heterostructure flip-chip light-emitting diodes
    Shen, YC
    Wierer, JJ
    Krames, MR
    Ludowise, MJ
    Misra, MS
    Ahmed, F
    Kim, AY
    Mueller, GO
    Bhat, JC
    Stockman, SA
    Martin, PS
    [J]. APPLIED PHYSICS LETTERS, 2003, 82 (14) : 2221 - 2223
  • [4] Optical cavity effects in InGaN/GaN quantum-well-heterostructure flip-chip light-emitting diodes
    Shen, YC
    Wierer, JJ
    Krames, MR
    Ludowise, MJ
    Misra, MS
    Ahmed, F
    Kim, AY
    Mueller, GO
    Bhat, JC
    Stockman, SA
    Martin, PS
    [J]. LIGHT -EMITTING DIODES: RESEARCH, MANUFACTURING, AND APPLICATIONS VIII, 2004, 5366 : 20 - 25
  • [5] Flip-chip InGaN Light-emitting Diodes with an Integrated Microlens Array
    Li, K. H.
    Choi, H. W.
    [J]. 2013 18TH MICROOPTICS CONFERENCE (MOC), 2013,
  • [6] High performance thin-film flip-chip InGaN-GaN light-emitting diodes
    Shchekin, O. B.
    Epler, J. E.
    Trottier, T. A.
    Margalith, T.
    Steigerwald, D. A.
    Holcomb, M. O.
    Martin, P. S.
    Krames, M. R.
    [J]. APPLIED PHYSICS LETTERS, 2006, 89 (07)
  • [7] Characteristics of flip-chip InGaN-based light-emitting diodes on patterned sapphire substrates
    Wang, Wei-Kai
    Wuu, Dong-Sing
    Lin, Shu-Hei
    Huang, Shih-Yung
    Han, Pin
    Horng, Ray-Hua
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (4B): : 3430 - 3432
  • [8] Micro-pixellated flip-chip InGaN and AlInGaN light-emitting diodes
    Griffin, C.
    Zhang, H. X.
    Guilhabert, B.
    Massoubre, D.
    Gu, E.
    Dawson, M. D.
    [J]. 2007 CONFERENCE ON LASERS & ELECTRO-OPTICS/QUANTUM ELECTRONICS AND LASER SCIENCE CONFERENCE (CLEO/QELS 2007), VOLS 1-5, 2007, : 61 - 62
  • [9] Heat sink performances of GaN/InGaN flip-chip light-emitting diodes fabricated on silicon and AlN submounts
    Jeng, Ming-Jer
    Chiang, Kuo-Ling
    Chang, Hsin-Yi
    Yen, Chia-Yi
    Lin, Cheng-Chen
    Chang, Yuan-Hsiao
    Lai, Mu-Jen
    Lee, Yu-Lin
    Chang, Liann-Be
    [J]. MICROELECTRONICS RELIABILITY, 2012, 52 (05) : 884 - 888
  • [10] Demonstration of Efficient Ultrathin Side-Emitting InGaN/GaN Flip-Chip Light-Emitting Diodes by Double Side Reflectors
    Kim, Tae Kyoung
    Islam, Abu Bashar Mohammad Hamidul
    Cha, Yu-Jung
    Oh, Seung Hyun
    Kwak, Joon Seop
    [J]. NANOMATERIALS, 2022, 12 (08)