共 50 条
- [31] Thermodynamic assessment of Sn-Co-Cu lead-free solder alloy ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 141 - 145
- [32] Reliability assessment of flip-chip assemblies with lead-free solder joints 52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1246 - 1255
- [33] Effects of Variable Amplitude Loading on Lead-Free Solder Joint Propoerties and Damage Accumulation 2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2012, : 740 - 744
- [35] Creep resistance of tin-based lead-free solder alloys Journal of Electronic Materials, 2005, 34 : 1373 - 1377
- [36] Annual nationwide environmental impact assessment of Japanese municipalities within the framework of endpoint-type LCIA method “LIME2” (Part 2): Visualization of temporal changes Journal of Environmental Engineering (Japan), 2020, 85 (77): : 523 - 533
- [39] Electrochemical migration behavior of Sn-based lead-free solder Journal of Materials Science: Materials in Electronics, 2019, 30 : 14695 - 14702
- [40] Reliability Assessment of Lead-Free Universal Solder for Direct Bonding in Power Electronics Packaging EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 1364 - +